PIC24HJ64GP210A-I/PT Microchip Technology, PIC24HJ64GP210A-I/PT Datasheet - Page 62

• Manufacturer Part Number: PIC24HJ64GP210A-I/PT
• Description: IC PIC MCU FLASH 64KB 100-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP210A-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 100-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8192 B
• Interface Type: SPI, I2C, UART
• Maximum Clock Frequency: 7.37 MHz
• Number Of Timers: 13
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX B:
This silicon errata issue was previously published in the
following documents, which are available from the
Microchip web site:
• dsPIC33FJXXXGPX06/X08/X10 Rev. A2 Silicon
• dsPIC33FJXXXMCX06/X08/X10 Rev. A2 Silicon
• PIC24HJXXXGPX06/X08/X10 Rev. A2 Silicon
This issue is included in this document to further assist
customers.
DS70152H-page 62
Errata (DS80306)
Errata (DS80307)
Errata (DS80280)
DEVICE ID REGISTER
SILICON ERRATA
ADDENDUM
1. Module: Device ID Register
On a few devices, the content of the Device ID
register can change from the factory programmed
default value immediately after RTSP or ICSP™
Flash programming.
As a result, development tools will not recognize
these devices and will generate an error message
indicating that the device ID and the device part
number
peripherals will be reconfigured and will not
function as described in the device data sheet.
Refer to Section 5. “Flash Programming”
(DS70191), of the “dsPIC33F Family Reference
Manual” for an explanation of RTSP and ICSP
Flash programming.
Work around
All RTSP and ICSP Flash programming routines
must be modified as follows:
1. No word programming is allowed. Any word
2. During row programming, load write latches as
3. After latches are loaded, reload any latch
4. Start
5. After row programming is complete, verify the
6. If Flash verification errors are found, repeat
Steps 1 through 5 in the work around are
implemented in MPLAB
MPLAB ICD 2, MPLAB REAL ICE™ in-circuit
emulator and MPLAB PM3 tools.
programming must be replaced with row
programming.
described in 5.4.2.3 “Loading Write Latches”
of
(DS70191).
location (in a given row) that has 5 LSB set to
0x18, with the original data. For example,
reload one of the following latch locations with
the desired data:
0xXXXX18, 0xXXXX38, 0xXXXX58,
0xXXXX78, 0xXXXX98, 0xXXXXB8,
0xXXXXD8, 0xXXXXF8
NVMOP<3:0> = ‘0001’ (Memory row program
operation) in the NVMCON register.
contents of Flash memory.
steps 2 through 5. If Flash verification errors
are found after a second iteration, report this
problem to Microchip.
Section
do
row
not
5.
© 2010 Microchip Technology Inc.
programming
match.
®
“Flash
IDE version 7.61 for the
Additionally,
Programming”
by
setting
some