STM32F103VBH6 STMicroelectronics, STM32F103VBH6 Datasheet
STM32F103VBH6
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STM32F103VBH6 Summary of contents
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Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces Features Core: ARM 32-bit Cortex™-M3 CPU I – 72 MHz, 90 DMIPS with 1.25 DMIPS/MHz – Single-cycle multiplication and hardware division – ...
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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F103xx 5.3.14 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of tables List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F103xx List of figures Figure 1. STM32F103xx performance line block diagram Figure 2. STM32F103xx performance line LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . ...
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Introduction 1 Introduction This datasheet provides the STM32F103xx performance line ordering information and mechanical device characteristics. For information on programming, erasing and protection of the internal Flash memory please refer to the STM32F10xxx Flash programming reference manual, pm0042, available from ...
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STM32F103xx 2.1 Device overview Table 2. Device features and peripheral counts (STM32F103xx performance line) Peripheral Flash - Kbytes SRAM - Kbytes General purpose Advanced Control SPI USART USB CAN GPIOs 12-bit synchronized ADC Number of channels CPU ...
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Description 2.2 Overview ® TM ARM Cortex -M3 core with embedded Flash and SRAM The ARM Cortex-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the ...
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STM32F103xx Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-16 MHz clock can be selected and is monitored for failure. During ...
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Description Voltage regulator The regulator has three operation modes: main (MR), low power (LPR) and power down used in the nominal regulation mode (Run) G LPR is used in the Stop modes. G Power down is used in ...
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STM32F103xx RTC (real-time clock) and backup registers The RTC and the backup registers are supplied through a switch that takes power either on V supply when present or through the V DD registers) can be used to store data when ...
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Description Advanced control timer (TIM1) The advanced control timer (TIM1) can be seen as a three-phase PWM multiplexed on 6 channels. It can also be seen as a complete general-purpose timer. The 4 independent channels can be used for Input ...
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STM32F103xx Universal serial bus (USB) The STM32F103xx performance line embeds a USB device peripheral compatible with the USB Full-speed 12 Mbs. The USB interface implements a full speed (12 Mbit/s) function interface. It has software configurable endpoint setting and suspend/resume ...
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Description Figure 1. STM32F103xx performance line block diagram –40 °C to +105 °C (junction temperature up to 125 ° alternate function on I/O port pin. 14/67 STM32F103xx ai14390 ...
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STM32F103xx 3 Pin descriptions Figure 2. STM32F103xx performance line LQFP100 pinout PE2 PE3 PE4 PE5 PE6 VBAT PC13-ANTI_TAMP PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 OSC_IN OSC_OUT NRST PC0 PC1 PC2 PC3 VSSA VREF- VREF+ VDDA PA0-WKUP PA1 PA2 ...
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Pin descriptions Figure 3. STM32F103xx performance line LQFP64 pinout PC13-ANTI_TAMP PC14-OSC32_IN PC15-OSC32_OUT PD0 OSC_IN PD1 OSC_OUT Figure 4. STM32F103xx performance line LQFP48 pinout PC15-OSC32_OUT 16/67 VBAT NRST PC0 LQFP64 PC1 PC2 PC3 VSSA VDDA PA0-WKUP PA1 PA2 ...
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STM32F103xx Figure 5. STM32F103xx performance line BGA100 ballout PC14- PC13- A PE2 OSC32_IN ANTI_TAMP PC15 BAT PE3 OSC32_OUT C OSC_IN V SS_5 PE4 D OSC_OUT V DD_5 PE5 E NRST PE6 PCD F PC0 PC1 ...
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Pin descriptions Table 3. Pin definitions Pins Pin name PE2/TRACECK PE3/TRACED0 PE4/TRACED1 PE5/TRACED2 PE6/TRACED3 BAT ...
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STM32F103xx Table 3. Pin definitions (continued) Pins Pin name PA4/SPI1_NSS USART2_CK/ADC_IN4 PA5/SPI1_SCK/ ADC_IN5 PA6/SPI1_MISO ADC_IN6/TIM3_CH1 PA7/SPI1_MOSI ADC_IN7/TIM3_CH2 PC4/ADC_IN14 H4 - ...
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Pin descriptions Table 3. Pin definitions (continued) Pins Pin name PB15/SPI2_MOSI TIM1_CH3N PD8 PD9 PD10 PD11 K10 - - 59 ...
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... This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, UM0306, available from the STMicroelectronics website: www.st.com. 7. For the LQFP48 and LQFP64 packages, the pins number 5 and 6 are configured as OSC_IN/OSC_OUT after reset, however the functionality of PD0 and PD1 can be remapped by software on these pins ...
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Memory mapping 4 Memory mapping The memory map is shown in Figure 6. Memory map 0xFFFF FFFF 0xFFFF F000 7 0xE010 0000 Cortex-M3 Internal Peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 ...
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STM32F103xx 5 Electrical characteristics 5.1 Test conditions Unless otherwise specified, all voltages are referred to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage ...
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Electrical characteristics Figure 7. Pin loading conditions 5.1.6 Power supply scheme Figure 9. Power supply scheme 1.8-3 × 100 × 10 µ µF ...
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STM32F103xx 5.1.7 Current consumption measurement Figure 10. Current consumption measurement scheme Electrical characteristics BAT V BAT DDA ai14126 25/67 ...
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Electrical characteristics 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 5: Current characteristics, and damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. ...
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STM32F103xx Table 6. Thermal characteristics Symbol T STG T J 5.3 Operating conditions 5.3.1 General operating conditions Table 7. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock frequency ...
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Electrical characteristics 5.3.3 Embedded reset and power control block characteristics The parameters given in temperature and V DD Table 9. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection V PVD hysteresis PVDhyst Power ...
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STM32F103xx 5.3.5 Supply current characteristics The current consumption is measured as described in measurement scheme. Maximum current consumption The MCU is placed under the following conditions: All I/O pins are in input mode with a static value ...
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Electrical characteristics Table 12. Maximum current consumption in Stop and Standby modes Symbol Parameter Regulator in Run mode, Low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog) Supply current in Stop mode Regulator in Low Power ...
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STM32F103xx Typical current consumption The MCU is placed under the following conditions: All I/O pins are in input mode with a static value All peripherals are disabled except explicitly mentioned. G The access time ...
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Electrical characteristics Table 14. Typical current consumption in Stop and Standby modes Symbol Parameter Supply current in Stop mode I DD Supply current in Standby mode Backup domain I DD_VBAT supply current 1. TBD stands for to be determined. 2. ...
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STM32F103xx 5.3.6 External clock source characteristics High-speed external user clock The characteristics given in external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 15. High-speed external (HSE) user clock characteristics Symbol Parameter User external ...
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Electrical characteristics Figure 11. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) EXTER NAL CLOCK SOURC E Figure 12. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t ...
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STM32F103xx High-speed external clock The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in ...
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Electrical characteristics Low-speed external clock The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in the ...
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STM32F103xx 5.3.7 Internal clock source characteristics The parameters given in temperature and V DD High-speed internal (HSI) RC oscillator Table 19. HSI oscillator characteristics Symbol Parameter f Frequency HSI ACC Accuracy of HSI oscillator HSI t HSI oscillator start up ...
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Electrical characteristics Wakeup time from low power mode The wakeup times given in oscillator. The clock source used to wake up the device depends from the current operating mode: Stop or Standby mode: the clock source is the RC oscillator ...
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STM32F103xx 5.3.9 Memory characteristics Flash memory The characteristics are given at T Table 23. Flash memory characteristics Symbol t Word programming time prog t Page (1kB) erase time ERASE t Mass erase time ME I Supply current DD 1. Values ...
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Electrical characteristics 5.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by ...
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STM32F103xx Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD stress ...
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Electrical characteristics 5.3.11 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a ...
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STM32F103xx 5.3.12 I/O port pin characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 7. All unused pins must be held at a fixed voltage, by using the I/O output mode, ...
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Electrical characteristics Figure 15. Unused I/O pin connection Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink +20 mA (with a relaxed V In the user application, the number of I/O ...
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STM32F103xx Output voltage levels Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 7. Table 30. Output voltage characteristics Symbol Output low level voltage for an I/O pin ( when 8 pins are ...
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Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 31, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 7. Table 31. I/O AC characteristics I/O ...
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STM32F103xx Figure 16. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved £ 2/3)T and if the duty cycle is (45-55%) 5.3.13 NRST pin characteristics The NRST pin input ...
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Electrical characteristics Figure 17. Recommended NRST pin protection External reset circuit 2. The reset network protects the device against parasitic resets. 3. The user must ensure that the level on the NRST pin can go below the V Table 32. ...
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STM32F103xx 5.3.15 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table The STM32F103xx performance line communication protocol with the following restrictions: the I/O ...
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Electrical characteristics 2 Figure 18 bus AC waveforms and measurement circuit bus S TART SDA t f(SDA) t h(STA) SCL t w(SCKH) 1. Measurement points are done at CMOS levels: 0.3V Table 35. SCL frequency ...
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STM32F103xx SPI interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table Refer to Section 5.3.12: I/O port pin characteristics alternate function characteristics (NSS, SCK, MOSI, MISO). Table 36. SPI characteristics Symbol Parameter ...
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Electrical characteristics Figure 19. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT 1. ...
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STM32F103xx Figure 21. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V USB characteristics ...
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Electrical characteristics Figure 22. USB timings: definition of data signal rise and fall time Differen tial Data L ines V CRS Table 38. USB: Full speed electrical characteristics Symbol Driver characteristics Rise/ ...
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STM32F103xx Table 39. ADC characteristics Symbol Parameter R External input impedance AIN External capacitor on analog C AIN input Negative input leakage current I lkg on analog pins R Sampling switch resistance ADC Internal sample and hold C ADC capacitor ...
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Electrical characteristics Figure 23. ADC accuracy characteristics 1023 1022 1LSB = IDEAL 1021 SSA Figure 24. Typical connection diagram using the ADC R AIN V AIN ...
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STM32F103xx General PCB design guidelines Power supply decoupling should be performed as shown in depending on whether V ceramic (good quality). They should be placed them as close as possible to the chip. Figure 25. Power supply and reference decoupling ...
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Electrical characteristics 5.3.18 Temperature sensor characteristics Table 41. TS characteristics Symbol SENSE Avg_Slope Average slope V Voltage at 25 ° Startup time START 58/67 Parameter Conditions linearity with temperature STM32F103xx Min Typ Max Unit ± ...
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STM32F103xx 6 Package characteristics Figure 27. LFBGA100 - low profile fine pitch ball grid array package outline Table 42. LFBGA100 - low profile fine pitch ball grid array package mechanical data Dim ...
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Package characteristics Figure 28. Recommended PCB design rules (0.80/0.75 mm pitch BGA) Dpad Dsm 60/67 Dpad 0.37 mm 0.52 mm typ. (depends on solder Dsm mask registration tolerance Solder paste 0.37 mm aperture diameter – Non solder mask defined pads ...
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STM32F103xx Figure 29. LQFP100 – 100-pin low-profile quad flat package outline Table 43. LQFP100 – 100-pin low-profile quad flat package mechanical data Dim. Min A A1 0.05 A2 1.35 b 0. θ 0° ...
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Package characteristics Figure 30. LQFP64 – 64 pin low-profile quad flat package outline Table 44. LQFP64 – 64 pin low-profile quad flat package mechanical data Dim. Min A A1 0.05 A2 1.35 b 0. ...
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STM32F103xx Figure 31. LQFP48 – 48 pin low-profile quad flat package outline Table 45. LQFP48 – 48 pin low-profile quad flat package mechanical data Dim. Min A A1 0.05 A2 1.35 b 0. ...
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Package characteristics 6.1 Thermal characteristics The average chip-junction temperature, T following equation: Where the Ambient Temperature in ° Θ is the Package Junction-to-Ambient Thermal Resistance, in ° C/ the sum of ...
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... STM32F103R8T6 STM32F103RBT6 STM32F103V8T6 STM32F103VBT6 STM32F103V8H6 STM32F103VBH6 7.1 Future family enhancements Further developments of the STM32F103xx performance line will see an expansion of the current options. Larger packages will soon be available with up to 512KB Flash, 64KB SRAM and with extended features such as EMI support, SDIO, I2S, DAC and additional timers and USARTS ...
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Revision history 8 Revision history Table 48. Document revision history Date Revision 01-jun-2007 1 20-Jul-2007 2 66/67 Changes Initial release. Flash memory size modified in Note BGA100 pins added to Table 3: Pin definitions. performance line BGA100 ballout added. T ...
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... STM32F103xx Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...