PIC10F204-I/MC Microchip Technology, PIC10F204-I/MC Datasheet - Page 87

• Manufacturer Part Number: PIC10F204-I/MC
• Description: IC PIC MCU FLASH 256X12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F204-I/MC

• Core Size: 8-Bit
• Program Memory Size: 384B (256 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Program Memory Type: FLASH
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC10
• No. Of I/o's: 4
• Ram Memory Size: 16Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: DFN
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Package: 8DFN EP
• Device Core: PIC
• Family Name: PIC10
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC103003 - BOARD DEMO PIC10F CAP TOUCHAC163020-2 - ADAPTER PROGRAM PIC10F 2X3 DFN
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Units
PIC10F200/202/204/206
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
–
E2
NOTE 1
DS41239D-page 85