STR751FR2T6 STMicroelectronics, STR751FR2T6 Datasheet - Page 50

MCU 32BIT 256KB FLASH 64-LQFP

STR751FR2T6

Manufacturer Part Number
STR751FR2T6
Description
MCU 32BIT 256KB FLASH 64-LQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR751FR2T6

Core Processor
ARM7
Core Size
32-Bit
Speed
60MHz
Connectivity
I²C, SPI, SSI, SSP, UART/USART, USB
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STR751x
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SPI, SSI, SSP, USB
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
38
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
For Use With
MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-5652

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STR751FR2T6
Manufacturer:
ST
Quantity:
10 000
Part Number:
STR751FR2T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STR751FR2T6
Manufacturer:
ST
Quantity:
20 000
Electrical parameters
6.3.6
50/84
Memory characteristics
Flash memory
Subject to general operating conditions for V
otherwise specified.
Table 26.
1. Data based on characterisation not tested in production
2. 10K program/erase cycles.
Table 27.
1. Data based on characterisation not tested in production.
N
N
Symbol
Symbol
END_B0
END_B1
Y
t
t
t
t
t
t
t
t
PDW
t
t
t
t
RPD
ESR
PB0
PB1
PSL
ESL
PW
RET
ES
ES
ES
ES
Word Program
Double Word Program
Bank 0 Program (256K)
Bank 1 Program (16K)
Sector Erase (64K)
Sector Erase (8K)
Bank 0 Erase (256K)
Bank 1 Erase (16K)
Recovery when disabled
Program Suspend Latency
Erase Suspend Latency
Endurance (Bank 0 sectors)
Endurance (Bank 1 sectors)
Data Retention
Erase Suspend Rate
Flash memory characteristics
Flash memory endurance and data retention
Parameter
Parameter
T
Min time from Erase
Resume to next Erase
Suspend
Single Word programming of
a checker-board pattern
Single Word programming of
a checker-board pattern
Not preprogrammed (all 1)
Preprogrammed (all 0)
Not preprogrammed (all 1)
Preprogrammed (all 0)
Not preprogrammed (all 1)
Preprogrammed (all 0)
Not preprogrammed (all 1)
Preprogrammed (all 0)
A
=85° C
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Conditions
Test Conditions
DD_IO
and V
18
, T
Min
A
100
10
20
20
= -40 to 105 °C unless
(1)
1.176
Typ
1.54
125
392
343
Value
8.0
6.6
0.9
0.8
35
60
2
Typ
Value
Max
2.94
2.38
224
560
532
4.9
13.7
11.2
300
Max
1.5
1.3
20
10
(2)
(2)
(2)
(2)
(1)
(2)
(2)
kcycles
kcycles
Years
Unit
Unit
ms
ms
μs
μs
μs
μs
μs
ms
s
s
s
s

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