C8051F064-GQ Silicon Laboratories Inc, C8051F064-GQ Datasheet - Page 317

IC 8051 MCU 64K FLASH 100TQFP

C8051F064-GQ

Manufacturer Part Number
C8051F064-GQ
Description
IC 8051 MCU 64K FLASH 100TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F06xr
Datasheets

Specifications of C8051F064-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-TQFP, 100-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
59
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C, SMBus, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
59
Number Of Timers
5
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F060DK
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 1 Channel
On-chip Dac
12 bit, 2 Channel
No. Of I/o's
59
Ram Memory Size
4352Byte
Cpu Speed
25MHz
No. Of Timers
5
Rohs Compliant
Yes
Package
100TQFP
Device Core
8051
Family Name
C8051F06x
Maximum Speed
25 MHz
Data Rom Size
64 KB
A/d Bit Size
16 bit
A/d Channels Available
1
Height
1.05 mm
Length
14 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
14 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1219 - KIT EVAL FOR C8051F064
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1218

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F064-GQ
Manufacturer:
SiliconL
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Part Number:
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Manufacturer:
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Quantity:
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Part Number:
C8051F064-GQR
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Silicon Laboratories Inc
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C8051F064-GQR
Manufacturer:
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Quantity:
20 000
Part Number:
C8051F064-GQR
0
26.
Each MCU has an on-chip JTAG interface and logic to support boundary scan for production and in-sys-
tem testing, Flash read/write operations, and non-intrusive in-circuit debug. The JTAG interface is fully
compliant with the IEEE 1149.1 specification. Refer to this specification for detailed descriptions of the Test
Interface and Boundary-Scan Architecture. Access of the JTAG Instruction Register (IR) and Data Regis-
ters (DR) are as described in the Test Access Port and Operation of the IEEE 1149.1 specification.
The JTAG interface is accessed via four dedicated pins on the MCU: TCK, TMS, TDI, and TDO.
Through the 16-bit JTAG Instruction Register (IR), any of the eight instructions shown in Figure 26.1 can
be commanded. There are three DR’s associated with JTAG Boundary-Scan, and four associated with
Flash read/write operations on the MCU.
IR Value
0xFFFF
0x0000
0x0002
0x0004
0x0082
0x0083
0x0084 Flash Address
0x0085
Bit15
JTAG (IEEE 1149.1)
Flash Control
Flash Scale
Instruction
Flash Data
PRELOAD
SAMPLE/
EXTEST
IDCODE
BYPASS
Selects FLASHSCL Register which controls the Flash one-shot timer and
Selects FLASHCON Register to control how the interface logic responds
Selects FLASHADR Register which holds the address of all Flash read,
Figure 26.1. IR: JTAG Instruction Register
Selects the Boundary Data Register for observability and presetting the
Selects FLASHDAT Register for reads and writes to the Flash memory
Selects the Boundary Data Register for control and observability of all
to reads and writes to the FLASHDAT Register
Rev. 1.2
Selects Bypass Data Register
write, and erase operations
Selects device ID Register
C8051F060/1/2/3/4/5/6/7
read-always enable
scan-path latches
Description
device pins
Bit0
Reset Value
0x0000
317

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