PIC12LC671-04I/SM Microchip Technology, PIC12LC671-04I/SM Datasheet - Page 115

• Manufacturer Part Number: PIC12LC671-04I/SM
• Description: IC MCU OTP 1KX14 LV A/D 8-SOIJ
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12LC671-04I/SM

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Processor Series: PIC12LC
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 8
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

14.0
14.1
1999 Microchip Technology Inc.
*
PACKAGING INFORMATION
Package Marking Information
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
8-Lead SOIC (208 mil)
8-Lead PDIP (300 mil)
8-Lead Windowed Ceramic Side Brazed (300 mil)
MMMMMM
Legend: MM...M
AABBCDE
Note:
MMMMMMM
XXXXXXX
MMMMMMMM
XXXXXCDE
MM
AABB
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Example
Example
Example
CE674
9924SAZ
12CE674
04/PSAZ
12C671
04I/SM
JW
9925
PIC12C67X
DS30561B-page 115