PIC16F887-E/P Microchip Technology, PIC16F887-E/P Datasheet - Page 18

• Manufacturer Part Number: PIC16F887-E/P
• Description: IC PIC MCU FLASH 8KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F887-E/P

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 35
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/USART
• On-chip Adc: 14-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 368 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53273-916
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD
• Lead Free Status / Rohs Status: Details

PIC16F88X
3.2.6.9
FIGURE 3-12:
3.2.6.10
After this command is performed, the entire program
memory and Configuration Words (0x2007-0x2008)
are erased. Data memory will also be erased if the CPD
bit in the Configuration Word is programmed (clear).
See Section 3.2.5 “Erase Algorithms” for erase
sequences.
FIGURE 3-13:
DS41287D-page 18
Note:
ICSPCLK
ICSPDAT
ICSPCLK
ICSPDAT
All Bulk Erase operations must take place
between 4.5V and 5.5V V
MCLR
End Programming
Bulk Erase Program Memory
V
IHH
END PROGRAMMING (SERIAL PROGRAM/VERIFY)
BULK ERASE PROGRAM MEMORY COMMAND
T
SET
1
1
1
1
0
DD
.
T
HLD
2
0
2
1
1
T
3
T
0
SET
3
0
SET
1
1
4
4
1
1
T
T
HLD
5
HLD
0
5
1
x
1
x
x
6
6
T
ERA
T
DIS
1
1
 2009 Microchip Technology Inc.
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