PIC16F883-I/SP Microchip Technology, PIC16F883-I/SP Datasheet - Page 271

IC PIC MCU FLASH 4KX14 28DIP

PIC16F883-I/SP

Manufacturer Part Number
PIC16F883-I/SP
Description
IC PIC MCU FLASH 4KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F883-I/SP

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-MCC2 - REFERENCE DESIGN MCP1631HVDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F883-I/SP
Manufacturer:
MICROCHIP
Quantity:
3 000
Part Number:
PIC16F883-I/SP
Manufacturer:
MICROCHIP
Quantity:
18
Part Number:
PIC16F883-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F883-I/SP
0
© 2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P or PL) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
PIC16F882/883/884/886/887
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
A2
1.980
MIN
.125
.015
.590
.485
.115
.008
.030
.014
E1
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.625
.070
.023
.250
.195
.580
.200
.015
.700
DS41291D-page 269
c

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