PIC16F876A-E/SP Microchip Technology, PIC16F876A-E/SP Datasheet - Page 220

• Manufacturer Part Number: PIC16F876A-E/SP
• Description: IC MCU FLASH 8KX14 W/AD 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F876A-E/SP

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Data Rom Size: 256 B
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC16F87XA
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
DS39582B-page 218
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
Drawing No. C04-114
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: mMO-220
CH X 45°
α
TOP VIEW
Dimension Limits
E1
E
Units
CH
A2
A1
A3
E1
E2
D1
D2
n
Q
A
E
D
B
R
α
n
p
L
2
1
MIN
A2
D1
.000
.140
.140
.009
.020
.005
.012
.009
A3
D
A
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
.008 REF
NOM
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
D2
28
R
MAX
EXPOSED
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12°
METAL
PADS
BOTTOM VIEW
MIN
E2
0.00
0.50
0.13
0.24
3.55
3.55
0.23
0.30
MILLIMETERS*
 2003 Microchip Technology Inc.
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.20 REF
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
MAX
Q
B
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
p
12°