DSPIC33FJ64GS606-E/PT Microchip Technology, DSPIC33FJ64GS606-E/PT Datasheet - Page 374

• Manufacturer Part Number: DSPIC33FJ64GS606-E/PT
• Description: MCU/DSP 16BIT 64KB FLASH 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GS606-E/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number Of I /o: 58
• Ram Size: 9K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Numeric And Arithmetic Format: Fixed-Point or Floating-Point
• Instruction Set Architecture: Harvard
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 58
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
FIGURE 27-12:
TABLE 27-31: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
DS70591C-page 374
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 27-1 for load conditions.
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SCK
2:
3:
4:
X
X
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
Symbol
SP36
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data
Input to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SP40
MSb In
MSb
Characteristic
SP11
SP41
SP30,SP31
SP35
SP10
(1)
Bit 14 - - - - - -1
Bit 14 - - - -1
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
Min
CY
CY
—
—
—
—
—
30
23
30
/2
/2
Typ
SP21
SP20
—
—
—
—
—
—
—
—
—
6
LSb In
(2)
LSb
Max
SP20
SP21
20
—
—
—
—
—
—
—
—
—
-40°C  T
-40°C  T
Units
 2010 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
 +85°C for Industrial
 +125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 4
See parameter D031
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
Conditions