PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 33

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

5.4
To allow portability of code, a PIC18FXX31 program-
mer is required to read the configuration word locations
from the HEX file. If configuration word information is
not present in the HEX file, then a simple warning mes-
sage should be issued. Similarly, while saving a HEX
file, all configuration word information must be
included. An option to not include the configuration
word information may be provided. When embedding
configuration word information in the HEX file, it should
start at address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
 2010 Microchip Technology Inc.
Embedding Configuration Word
Information in the HEX File
PIC18F2331/2431/4331/4431
5.5
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The configuration word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-5 (pages 34 through 36) describes how to
calculate the checksum for each device.
Note 1: The checksum calculation differs depend-
Checksum Computation
ing on the code protect setting. Since the
code memory locations read out differ-
ently depending on the code protect set-
ting,
manipulate the actual code memory val-
ues to simulate the values that would be
read from a protected device. When cal-
culating a checksum by reading a device,
the entire code memory can simply be
read and summed. The configuration
word and ID locations can always be
read.
the
table
describes
DS30500B-page 33
how
to