PIC16F876A-I/SS Microchip Technology, PIC16F876A-I/SS Datasheet - Page 23

• Manufacturer Part Number: PIC16F876A-I/SS
• Description: IC MCU FLASH 8KX14 EE 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F876A-I/SS

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• Controller Family/series: PIC16F
• No. Of I/o's: 22
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Data Rom Size: 256 B
• Height: 1.75 mm
• Length: 10.2 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 5.3 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
• Lead Free Status / Rohs Status: Details
• Other names: PIC16F876AI/SS

1.5.3.8
1.5.3.9
1.5.3.10
1.5.3.11
1.5.3.12
1997 Microchip Technology Inc.
ROM Devices
DIE
Specialized Services
Quick Turn Production (QTP) Programming
Serialized Quick Turn Production (SQTP
ROM devices have their program memory fixed at the time of the silicon manufacture. Since the
program memory cannot be changed, the device can be housed in the lower cost plastic pack-
age.
The DIE option allows the board size to become as small as physically possible. The DIE Support
document (DS30258) explains general information about using and designing with DIE. There
are also individual specification sheets that detail DIE specific information. Manufacturing with
DIE requires special knowledge and equipment. This means that the number of manufacturing
houses that support DIE will be limited. If you decide to use the DIE option, please research your
manufacturing sites to ensure that they will be able to meet the specialized requirements of DIE
use.
For OTP customers with established code, Microchip offers two specialized services. These two
services, Quick Turn Production Programming and Serialized Quick Turn Production Program-
ming, that allow customers to shorten their manufacturing cycle time.
Microchip offers this programming service for factory production orders. This service is made
available for users who choose not to program a medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to the OTP devices but with all EPROM loca-
tions and configuration options already programmed by the factory. Certain code and prototype
verification procedures apply before production shipments are available. Please contact your
local Microchip sales office for more details.
Microchip offers a this unique programming service where a few user-defined locations in each
device are programmed with different serial numbers. The serial numbers may be random,
pseudo-random or sequential.
Serial programming allows each device to have a unique number which can serve as an
entry-code, password or ID number.
SM
) Programming
Section 1. Introduction
DS31001A-page 1-11
1