PIC18F2620-I/SO Microchip Technology, PIC18F2620-I/SO Datasheet - Page 2

• Manufacturer Part Number: PIC18F2620-I/SO
• Description: IC MCU FLASH 32KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2620-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3986 B
• Interface Type: SPI/I2C/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18F4620 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2525/2620/4525/4620
2. Module: MSSP
DS80282C-page 2
With MSSP in SPI Master mode, F
Timer2/2 clock rate, and CKE = 0, a write collision
may occur if SSPBUF is loaded immediately after
the transfer is complete. A delay may be required
after the MSSP Interrupt Flag bit, SSPIF, is set or
the Buffer Full bit, BF, is set and before writing
SSPBUF. If the delay is insufficiently short, a write
collision may occur as indicated by the WCOL bit
being set.
Work around
Add a software delay of one SCK period after
detecting the completed transfer and prior to
updating the SSPBUF contents. Verify the WCOL
bit is clear after writing SSPBUF. If the WCOL is
set, clear the bit in software and rewrite the
SSPBUF register.
Date Codes that pertain to this issue:
All engineering and production devices.
OSC
/64 or
3. Module: Enhanced Capture/Compare/
4. Module: Enhanced Universal
With the ECCP configured for Half-Bridge PWM
mode (CCP1M3:0 = 1110), the output may be
corrupted for particular duty cycle selections.
Affected duty cycle values are 0 though 3, and
every subsequent increment of 4 (i.e., 7, 11, 15,
19, etc.).
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
One bit has been added to the BAUDCON register
and one bit has been renamed. The added bit is
RXDTP and is in the location, BAUDCON<5>. The
renamed bit is the TXCKP bit (BAUDCON<4>),
which had been named SCKP.
The
(BAUDCON<5>) bits enable the Asynchronous
mode TX and RX signals to be inverted (polarity
reversed).
Synchronous mode DT signal.
Register 18-3, on page 204, will be changed as
shown on page 3.
Work around
None required.
Date Codes that pertain to this issue:
All engineering and production devices.
TXCKP
PWM (ECCP)
Synchronous Receiver
Transmitter (EUSART)
RXDTP
(BAUDCON<4>)
© 2007 Microchip Technology Inc.
has
no
effect
and
on
RXDTP
the