AT32UC3B0256-A2UT Atmel, AT32UC3B0256-A2UT Datasheet - Page 55

• Manufacturer Part Number: AT32UC3B0256-A2UT
• Description: IC MCU AVR32 256KB FLASH 64-TQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3B0256-A2UT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 44
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Processor Series: AT32UC3x
• Core: AVR32
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: 2-Wire/SPI/USART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 44
• Number Of Timers: 3
• Operating Supply Voltage: 1.65 V to 1.95 V / 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR32, EWAVR32-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1101
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: AVR UC3
• No. Of I/o's: 44
• Ram Memory Size: 32KB
• Cpu Speed: 60MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• For Use With: ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATSTK600-TQFP64-2 - STK600 SOCKET/ADAPTER FOR 64-TQFATEVK1101 - KIT DEV/EVAL FOR AVR32 AT32UC3B
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10. Mechanical Characteristics
10.1
10.1.1
10.1.2
32059K–03/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 10-1
Table 10-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 10-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
55.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
55.
JA
)
42.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
AT32UC3B
Table 10-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
55