DSPIC30F6012T-20E/PF Microchip Technology, DSPIC30F6012T-20E/PF Datasheet - Page 10

• Manufacturer Part Number: DSPIC30F6012T-20E/PF
• Description: IC DSPIC MCU/DSP 144K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6012T-20E/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-TQFP, 64-VQFP
• For Use With: XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F6012T20EP

dsPIC30F6011/6012/6013/6014
16. Module: Data Converter Interface – Idle
17. Module: CAN – Read Operations on SFRs
EXAMPLE 12:
DS80198J-page 10
For this release of silicon, the DCI module should
not be stopped when the device enters Idle mode.
Work around
Do not set the DCISIDL (DCICON1<13>) bit. This
will ensure the DCI module continues to run when
the device enters Idle mode.
Data read from the CAN module Special Function
Registers may not be correct at device operation
greater than 20 MIPS for V
to 5.5V (or 10 MIPS for V
3.6V).
If the dsPIC DSC device needs to operate at a
throughput higher than 20 MIPS, the user should
incorporate the suggested work arounds while
reading CAN SFRs.
Applications that use Microchip’s dsPIC30F
Peripheral
CANbedded software, should operate the device
at 20 MIPS or less.
Work arounds
Work around 1: For Assembly Language
Source Code
When reading any CAN SFR, perform two
consecutive read operations of that SFR. The work
around is demonstrated in Example 12. In this
example, a Memory-Direct Addressing mode is
used to read the SFR. The application may use
any addressing mode to perform the read
operation. Note that interrupts must be disabled so
that the two consecutive reads do not get
interrupted.
Work around 2: For C Language Source Code
For C programmers, the MPLAB C30 v1.20.02
toolsuite provides a built-in function that may be
incorporated in the application source code. This
function may be used to read any CAN module
SFRs. Some examples of usage are shown in the
“readme.txt file” provided with the MPLAB
C30 v1.20.02 toolsuite. The function has the
following prototype:
unsigned __builtin_readsfr(volatile void *);
The function argument is the address of a 16-bit
SFR. This function should only be used to read the
CAN Special Function Registers.
.include “p30f6014.inc”
....
disi
mov
mov
#1
C1RXF0SIDL, w0 ; first SFR read
C1RXF0SIDL, w0 ; second SFR read
Library
CONSECUTIVE READS
and
DD
DD
Vector
in the range 3V to
in the range 4.75V
Informatik’s
18. Module: High I
This release of silicon draws a current (I
approximately 370 mA during any Row Erase
operation performed on program Flash memory.
Work arounds
Work around 1:
Supply the V
capable of sourcing a minimum of 300 mA of
current.
Work around 2:
When using a voltage regulator capable of driving
150 mA current and if Brown-out Reset (BOR) is
enabled for a V
then connect a 1000 μF Electrolytic capacitor
across the V
If the Row Erase operation is performed as part of
a Run-Time Self Programming (RTSP) operation,
the user should ensure that the device is operating
at less than 10 MIPS prior to the erase operation.
To ensure that the device is operating at less than
10 MIPS, the application may post-scale the
system clock or switch to the internal FRC
oscillator.
Program Flash Memory
DD
DD
pin and ground.
DD
DD
pin using a voltage regulator
© 2008 Microchip Technology Inc.
greater than or equal to 4.2V,
During Row Erase of
DD
) of