STR750FV2T6 STMicroelectronics, STR750FV2T6 Datasheet - Page 6

• Manufacturer Part Number: STR750FV2T6
• Description: MCU 32BIT 256KB FLASH 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STR7r

Specifications of STR750FV2T6

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, SPI, SSI, SSP, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Cpu Family: STR7
• Device Core: ARM7TDMI-S
• Device Core Size: 32b
• Frequency (max): 60MHz
• Interface Type: CAN/I2C/SPI/SSI/SSP
• Total Internal Ram Size: 16KB
• # I/os (max): 72
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.97V
• On-chip Adc: 16-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Processor Series: STR750x
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 72
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• For Use With: MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5988 - BOARD DEVELOPMENT LOVE STR750497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5751 - KIT STARTER HITEX FOR STR750497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-5650

Introduction
6/84
Serial memory interface (SMI)
The Serial Memory interface is directly able to access up to 4 serial FLASH devices. It can
be used to access data, execute code directly or boot the application from external memory.
The memory is addressed as 4 banks of up to 16 Mbytes each.
Clocks and start-up
After RESET or when exiting from Low Power Mode, the CPU is clocked immediately by an
internal RC oscillator (FREEOSC) at a frequency centered around 5 MHz, so the application
code can start executing without delay. In parallel, the 4/8 MHz Oscillator is enabled and its
stabilization time is monitored using a dedicated counter.
An oscillator failure detection is implemented: when the clock disappears on the XT1 pin, the
circuit automatically switches to the FREEOSC oscillator and an interrupt is generated.
In Run mode, the AHB and APB clock speeds can be set at a large number of different
frequencies thanks to the PLL and various prescalers: up to 60 MHz for AHB and up to 32
MHz for APB when fetching from Flash (64 MHz and 32 MHz when fetching from SRAM).
In SLOW mode, the AHB clock can be significantly decreased to reduce power
consumption.
The built-in Clock Controller also provides the 48 MHz USB clock directly without any extra
oscillators or PLL. For instance, starting from the 4 MHz crystal source, it is possible to
obtain in parallel 60 MHz for the AHB clock, 48 MHz for the USB clock and 30 MHz for the
APB peripherals.
Boot modes
At start-up, boot pins are used to select one of five boot options:
●
●
●
●
Booting from SMI memory allows booting from a serial flash. This way, a specific boot
monitor can be implemented. Alternatively, the STR750F can boot from the internal boot
loader that implements a boot from UART.
Power supply schemes
You can connect the device in any of the following ways depending on your application.
●
●
●
Boot from internal flash
Boot from external serial Flash memory
Boot from internal boot loader
Boot from internal SRAM
Power Scheme 1: Single external 3.3V power source. In this configuration the
V
regulator and the V
regulator. This scheme has the advantage of requiring only one 3.3V power source.
Power Scheme 2: Dual external 3.3V and 1.8V power sources. In this configuration,
the internal voltage regulators are switched off by forcing the VREG_DIS pin to high
level. V
V
for applications which already provide an 1.8V power supply.
Power Scheme 3: Single external 5.0V power source. In this configuration the
V
CORE
BACKUP
CORE
supply required for the internal logic is generated internally by the main voltage
supply required for the internal logic is generated internally by the main voltage
CORE
through the V
is provided externally through the V
BACKUP
18_BKP
supply is generated internally by the low power voltage
pin. This scheme is intended to save power consumption
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
18
and V
18REG
power pins and