C8051F313-GMR Silicon Laboratories Inc, C8051F313-GMR Datasheet - Page 226

• Manufacturer Part Number: C8051F313-GMR
• Description: IC 8051 MCU 8K FLASH 28MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F31xr

Specifications of C8051F313-GMR

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 25
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

C8051F310/1/2/3/4/5/6/7
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Revision 1.6 to Revision 1.7
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226
OCUMENT
Added two part numbers: C8051F316 and C8051F317
Changed package nomenclature from MLP to QFN.
Chapter 1.“System Overview”: Updated Table 1.1, “Product Selection Guide,” on page 18, with new
ordering part numbers; added block diagrams for the new parts, and updated Figure 1.13.
Added Table 3.2, “Electrical Characteristics Quick Reference,” on page 38.
Chapter 4.“Pinout and Package Definitions”: Updated Table 4.1 and added package diagrams for the
new parts.
Chapter 5.“10-Bit ADC (ADC0, C8051F310/1/2/3/6 only)”: Updated Figure 5.1, SFR Definition 5.1, and
SFR Definition 5.2 to show behavior of new parts.
Chapter 9.“Reset Sources”: Added note to SFR Definition 9.2 describing the behavior of read-modify-
write instructions on this register; Corrected Max VDD Ramp Time to 1 mS.
Chapter 10.“Flash Memory”: Updated Table 10.1 to accommodate the new parts; Added Table 10.2,
“Flash Security Summary,” on page 114 for clarity, replacing the Flash security summaries text.
Chapter 13.“Port Input/Output”: Updated text, Figure 13.1, Figure 13.3, Figure 13.4, and SFR Defini-
tion 13.7 through SFR Definition 13.17 to accommodate the new part numbers.
Chapter 18.“Programmable Counter Array”: In Table 18.3, corrected internal oscillator reset frequency
from 3,060,000 Hz to 3,062,500 Hz.
Chapter 20.“C2 Interface”: Updated C2 Register Definition 20.2 to accommodate the new part num-
bers. Corrected Device ID that is common to all 'F31x devices from 0x09 to 0x08; Removed references
to "boundary scan" because this feature is not supported by the 'F31x devices.
Fixed various minor errors.
Updated values in Table 3.1, “Global DC Electrical Characteristics,” on page 36.
Added Section
C
“10.4. Flash Write and Erase
HANGE
L
IST
Rev. 1.7
Guidelines” on page 115.