PIC18F442-E/ML Microchip Technology, PIC18F442-E/ML Datasheet - Page 4

• Manufacturer Part Number: PIC18F442-E/ML
• Description: IC MCU FLASH 8KX16 EE A/D 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F442-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 44-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18FXX2
Clarifications/Corrections to the
Data Sheet:
In the Device Data Sheet (DS39564B), the following
clarifications and corrections should be noted.
1. Module: DC Characteristics
22.1
DS80173C-page 4
PIC18LFXX2
PIC18FXX2
D005
D005
D005
Legend: Shading of rows is to assist in readability of the table.
Note 1:
Param
No.
(Industrial)
(Industrial, Extended)
The values for parameters, D005, D010A,
D022A and D022B, shown in Section 22.1 “DC
Characteristics” of the Device Data Sheet have
changed (modified text is shown in bold):
2:
3:
4:
DC Characteristics: PIC18FXX2 (Industrial, Extended)
V
Symbol
This is the limit to which V
data.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR,...).
For RC osc configuration, current through R
estimated by the formula Ir = V
BOR
Brown-out Reset Voltage
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
BORV1:BORV0 = 11 1.96
BORV1:BORV0 = 10 2.64
BORV1:BORV0 = 01 4.11
BORV1:BORV0 = 00 4.41
BORV1:BORV0 = 1x N.A.
BORV1:BORV0 = 01 4.16
BORV1:BORV0 = 00 4.45
BORV1:BORV0 = 1x N.A.
BORV1:BORV0 = 01 4.07
BORV1:BORV0 = 00 4.36
Characteristic
DD
PIC18LFXX2
PIC18FXX2
PIC18FXX2
; WDT enabled/disabled as specified.
PIC18LFXX2 (Industrial)
DD
DD
can be lowered in Sleep mode, or during a device Reset, without losing RAM
measurements in active operation mode are:
DD
/2R
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
EXT
(mA) with R
2.06 2.16
2.78 2.92
4.33 4.55
4.64 4.87
Typ
—
—
—
—
—
—
EXT
is not included. The current through the resistor can be
Max Units
N.A.
4.83
N.A.
4.59
4.92
4.5
EXT
V
V
V
V
V
V
V
V
V
V
in kΩ.
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
85°C ≥ T ≥ 25°C
Not in operating voltage range of device
Extended devices operating at 125°C
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
© 2005 Microchip Technology Inc.
Conditions
DD
DD
or V
SS
and