LT1636CS8#PBF Linear Technology, LT1636CS8#PBF Datasheet - Page 14
LT1636CS8#PBF
Manufacturer Part Number
LT1636CS8#PBF
Description
IC OPAMP R-R IN/OUT 220KHZ 8SOIC
Manufacturer
Linear Technology
Series
Over-The-Top®r
Datasheet
1.LT1636CN8PBF.pdf
(16 pages)
Specifications of LT1636CS8#PBF
Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Slew Rate
0.075 V/µs
Gain Bandwidth Product
220kHz
Current - Input Bias
4nA
Voltage - Input Offset
100µV
Current - Supply
50µA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 44 V, ±1.35 V ~ 22 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LT1636
14
PACKAGE
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
DESCRIPTION
0.28 ± 0.05
(.0165 ± .0015)
0.42 ± 0.04
GAUGE PLANE
(.077)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
(.010)
0.254
U
0.675 ±0.05
DETAIL “A”
PACKAGE
OUTLINE
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
0° – 6° TYP
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
8-Lead Plastic MSOP
TOP MARK
(.021 ± .006)
0.53 ± 0.015
MS8 Package
PIN 1
DD Package
0.200 REF
SEATING
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
PLANE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
(1.93 ± .006)
(.118 ± .004)
3.00 ± 0.102
4.90 ± 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
1
8
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
3.00 ± 0.102
(.118 ± .004)
(.206)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 ± .003)
0.13 ± 0.076
MSOP (MS8) 0802
BOTTOM VIEW—EXPOSED PAD
0.28 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 0203
1636fc