BA10358FV-E2 Rohm Semiconductor, BA10358FV-E2 Datasheet - Page 22

• Manufacturer Part Number: BA10358FV-E2
• Description: IC OPAMP DUAL 32V 0.7MA SSOP-B8
• Manufacturer: Rohm Semiconductor

Specifications of BA10358FV-E2

• Slew Rate: 0.2 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Gain Bandwidth Product: 500kHz
• Current - Input Bias: 45nA
• Voltage - Input Offset: 2000µV
• Current - Supply: 700µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 3 V ~ 32 V, ±1.5 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SSOP
• Op Amp Type: General Purpose
• No. Of Amplifiers: 2
• Supply Voltage Range: 3V To 32V
• Amplifier Case Style: SSOP
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Svhc: No
• Number Of Channels: 2
• Voltage Gain Db: 100 dB
• Common Mode Rejection Ratio (min): 65 dB
• Input Offset Voltage: 7 mV
• Operating Supply Voltage: 3 V to 32 V
• Supply Current: 0.7 mA
• Maximum Power Dissipation: 350 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 16 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details
• Other names: BA10358FV-E2; BA10358FV-E2TR

BA10358F/FV, BA10324AF/FV, BA2904SF/FV/FVM, BA2904F/FV/FVM
BA2902SF/FV/KN, BA2902F/FV/KN, BA3404F/FVM
●Derating curves
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www.rohm.com
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.125(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
Derating curve in Fig.125(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package
condition, wind velocity, etc even when the same of package is used.
Thermal reduction curve indicates a reference value measured at a specified condition. Fig.126(c)～(f) show a derating
curve for an example of BA10358, BA10324A, BA2904S, BA2904, BA2902S, BA2902, BA3404.
When using the unit above Ta=25[℃], subtract the value above per degree [℃].
Permissible dissipation is the value when FR4 glass epoxy board 70[mm] ×70[mm] ×1.6[mm] (cooper foil area below 3[%]) is mounted.
(*15)
6.2
(*16)
5.5
1000
1000
800
600
400
200
800
600
400
200
Chip surface temperature
Power dissipation Pd[W]
0
0
Ambient temperature
0
0
θja = ( Tj ー Ta ) / Pd [ ℃ /W]
590mW(*21)
690mW( *6)
620mW (*1)
550mW (*2)
780mW( *5)
780mW(*19)
690mW(*20)
590mW (*7)
550mW(*16)
620mW(*15)
(a)Thermal resistance
(*17)
7.0
θja = (Tj-Ta) / Pd
25
Ambient temperature ：Ta [℃]
25
(e) BA2904/BA3404 family
Ambient temperature ：Ta [℃]
チップ 表面温度 Tj [ ℃ ]
消費電力 P [W]
(c) BA10358 family
BA2904SFV
BA2904SF
BA2904F
BA3404F
周囲温度 Ta [ ℃ ]
(a) BA10358 ファミリ
BA10358F
BA2904SFVM
(a) BA2904 ファミリ
50
周囲温度 Ta [ ℃ ]
周囲温度 Ta [ ℃ ]
50
BA2904FV
(*18)
4.9
75
BA2904FVM
BA3404FVM
BA10358FV
Fig. 125 Thermal resistance and derating
85
BA2904FVM
75
100
105
Fig. 126 Derating curve
BA3404F
BA3404FVM
100
(*19)
[℃/W]
6.2
125
125
150
(*20)
22/25
5.5
Power dissipation of LSI
・・・・・ (Ⅰ)
1000
1000
800
600
400
200
800
600
400
200
0
0
LSI の 消 費 電 力 [W]
P2
P1
0
0
(*21)
610mW(*24)
870mW( *8)
660mW( *9)
610mW (*10)
870mW(*22)
660mW(*23)
4.8
0
700mW (*3)
490mW (*4)
700mW(*17)
490mW(*18)
Pd (max)
25
25
Ambient temperature
Ambient temperature ：Ta [℃]
25
Ambient temperature ：Ta [℃]
BA2902SKN
BA2902SFV
(b) Derating curve
BA2902FV
(d) BA10324 family
(f) BA2902 family
(b)
(a) BA10324A ファミリ
BA10324AFV
BA2902SF
50
(a) BA2902 ファミリ
(*22)
7.0
周囲温度 Ta [ ℃ ]
周囲温度 Ta [ ℃ ]
50
50
BA2902KN
θ' ja1
75
周 囲 温 度 Ta [ ℃ ]
BA10324AF
75
75
θ ja1
100
θja2 < θja1
(*23)
105
BA2902F
5.3
θ' ja2
100
100
125
θ ja2
125
150
125
(*24)
Tj ' (max)
4.9
Technical Note
2010.11 - Rev.A
150
Tj (max)
[mW/℃]
Unit