OP291GSZ Analog Devices Inc, OP291GSZ Datasheet - Page 23

• Manufacturer Part Number: OP291GSZ
• Description: IC OPAMP GP R-R 3MHZ DUAL 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of OP291GSZ

• Slew Rate: 0.5 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 3MHz
• Current - Input Bias: 30nA
• Voltage - Input Offset: 80µV
• Current - Supply: 260µA
• Current - Output / Channel: 16mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ±1.35 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Low Power
• No. Of Amplifiers: 2
• Bandwidth: 3MHz
• Supply Voltage Range: 2.7V To 12V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Channel Separation: 145
• Common Mode Rejection Ratio: 93
• Current, Input Bias: 30 nA
• Current, Input Offset: 0.1 nA
• Current, Output: ±13.5 mA
• Current, Supply: 220 μA
• Impedance, Thermal: 43 °C/W
• Number Of Amplifiers: Dual
• Package Type: SOIC-8
• Temperature, Operating, Range: -40 to +125 °C
• Voltage, Gain: 70 V/mV
• Voltage, Input: 0 to +5 V
• Voltage, Noise: 42 nV/sqrt Hz
• Voltage, Offset: 80 μV
• Voltage, Output, High: 4.99 V
• Voltage, Output, Low: 4.5 mV
• Voltage, Supply: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

OUTLINE DIMENSIONS
COPLANARITY
COPLANARITY
0.25 (0.0098)
0.10 (0.0039)
1.05
1.00
0.80
COPLANARITY
0.10
4.00 (0.1575)
3.80 (0.1496)
PIN 1
0.10
4.50
4.40
4.30
0.15
0.05
0.25 (0.0098)
0.10 (0.0040)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
4.00 (0.1574)
3.80 (0.1497)
Figure 76. 14-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 75. 14-Lead Standard Small Outline Package [SOIC_N]
Figure 74. 8-Lead Standard Small Outline Package [SOIC_N]
14
1
0.65 BSC
SEATING
PLANE
14
1
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
8.75 (0.3445)
8.55 (0.3366)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
COMPLIANT TO JEDEC STANDARDS MS-012-AA
5.10
5.00
4.90
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
BSC
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
1
8
Dimensions shown in millimeters
BSC
8
7
Narrow Body (R-14) [S-Suffix]
Narrow Body (R-8) [S-Suffix]
8
7
5
4
0.51 (0.0201)
0.31 (0.0122)
BSC
6.40
Rev. E | Page 23 of 24
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
1.20
MAX
6.20 (0.2441)
5.80 (0.2284)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
1.75 (0.0688)
1.35 (0.0532)
(RU-14)
0.20
0.09
0.25 (0.0098)
0.17 (0.0067)
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
8°
0°
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
45°
0.75
0.60
0.45
45°
OP191/OP291/OP491