MC34072DG ON Semiconductor, MC34072DG Datasheet - Page 23

• Manufacturer Part Number: MC34072DG
• Description: IC OPAMP DUAL 4.5MHZ HS 8-SOIC
• Manufacturer: ON Semiconductor

Specifications of MC34072DG

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 13 V/µs
• Gain Bandwidth Product: 4.5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 1000µV
• Current - Supply: 1.9mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 44 V, ±1.5 V ~ 22 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 70 dB
• Input Voltage Range (max): Positive Rail - 1.8 V
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 5 mV
• Input Bias Current (max): 500 nA
• Operating Supply Voltage: 44 V
• Supply Current: 3.8 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V, +/- 9 V
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Dual Supply Voltage: +/- 1.5 V
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 44 V
• Supply Voltage (min): 3 V
• Technology: Bipolar
• Voltage Gain Db: 100 dB
• Bandwidth: 4.5 MHz
• Channel Separation: 120
• Common Mode Rejection Ratio: 97
• Current, Input Bias: 700 nA
• Current, Input Offset: 300 nA
• Current, Output: 30 mA
• Current, Supply: 2.8 mA
• Harmonic Distortion: 0.02 %
• Number Of Amplifiers: Dual
• Package Type: SOIC-8
• Resistance, Input: 150 Megohms
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Gain: 20 V/mV
• Voltage, Input: ±15 V
• Voltage, Noise: 32 nV/sqrt Hz
• Voltage, Offset: 7 mV
• Voltage, Output, High: 13.4 V
• Voltage, Output, Low: -13.5 V
• Voltage, Supply: 3 to 44 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC34072DG; MC34072DGOS

−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
*For additional information on our Pb−Free strategy and soldering
Y
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
Y
http://onsemi.com
M
N
CASE 751−07
SOIC−8 NB
X 45
ISSUE AJ
_
M
23
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_