MCP617-I/P Microchip Technology, MCP617-I/P Datasheet - Page 33

• Manufacturer Part Number: MCP617-I/P
• Description: IC OPAMP 2.3V DUAL R-R 8DIP
• Manufacturer: Microchip Technology

Specifications of MCP617-I/P

• Slew Rate: 0.08 V/µs
• Package / Case: 8-DIP (0.300", 7.62mm)
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 190kHz
• Current - Input Bias: 15nA
• Voltage - Input Offset: 150µV
• Current - Supply: 19µA
• Current - Output / Channel: 17mA
• Voltage - Supply, Single/dual (±): 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 80 dB
• Input Offset Voltage: 0.15 mV
• Input Bias Current (max): 5000 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.3 V
• Technology: BiCMOS
• Voltage Gain Db: 120 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision C (October 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Revision B (April 2005)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Revision A (April 2001)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
Added Section 1.1 “Test Circuits”.
Added
Added
Section 4.1.2 “Input Voltage and Current
Limits”, and Section 4.1.3 “Normal Opera-
tion”.
Updated
Updated Section 5.0 “Design Aids”.
Updated Section 6.0 “Packaging Informa-
tion”
Clarified specifications found in Section 1.0
“Electrical Characteristics”.
Updated Section 2.0 “Typical Performance
Curves” and added input noise current density
plot.
Added Section 3.0 “Pin Descriptions”.
Updated Section 4.0 “Applications Informa-
tion”.
Updated the SPICE macro model and added
information on the FilterLab software, in
Section 5.0 “Design Aids”.
Corrected
(Section 6.0 “Packaging Information”).
Added Appendix A: “Revision History”.
Figure
Figure
Section 4.1.1
package
2-36.
4-7.
REVISION HISTORY
marking
“Phase
Reversal”,
information
MCP616/7/8/9
DS21613C-page 29