PA79DK Cirrus Logic Inc, PA79DK Datasheet - Page 10

• Manufacturer Part Number: PA79DK
• Description: IC PWR AMP 350V 200MA 20PSOP
• Manufacturer: Cirrus Logic Inc
• Series: Apex Precision Power™r

Specifications of PA79DK

• Slew Rate: 350 V/µs
• Package / Case: 20-PSOP
• Amplifier Type: Power
• Number Of Circuits: 2
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 8.5pA
• Voltage - Input Offset: 8000µV
• Current - Supply: 700µA
• Current - Output / Channel: 150mA
• Voltage - Supply, Single/dual (±): 20 V ~ 350 V, ±10 V ~ 175 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 90 dB
• Input Offset Voltage: 40 mV
• Input Bias Current (max): 200 pA
• Operating Supply Voltage: 300 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Dual Supply Voltage: +/- 150 V
• Maximum Dual Supply Voltage: +/- 175 V
• Minimum Dual Supply Voltage: +/- 10 V
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 350 V
• Supply Voltage (min): 20 V
• Technology: BiFET
• Voltage Gain Db: 120 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 598-1398 - KIT EVALUATION PA78/PA79
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 598-1352

PA79
LAYOUT CONSIDERATIONS
The PA79 is built on a dielectrically isolated process and the package tab is therefore not electrically connected
to the amplifier. For high speed operation, the package tab should be connected to a stable reference to reduce
capacitive coupling between amplifier nodes and the floating tab. It is often convenient to directly connect the tab
to GND or one of the supply rails, but an AC connection through a 1µF capacitor to GND is also sufficient if a DC
connection is undesirable
Care should be taken to position the R
loops in these paths pick up noise and increase the likelihood of L
The PA79DK package has a large exposed integrated copper heatslug to which the monolithic amplifier is directly
attached. The solder connection of the heat slug to a 1 square inch foil area on the printed circuit board will result
in improved thermal performance of 25ºC/W. In order to improve the thermal performance, multiple metal layers in
the printed circuit board are recommended. This may be adequate heatsinking but the large number of variables
involved suggest temperature measurements be made on the top of the package. Do not allow the temperature to
exceed 85ºC.
The junction to ambient thermal resistance of the DK package can achieve a 19.1ºC/W rating by using the PCB
conditions outlined in JEDEC standard: (JESD51–5):
MOISTURE SENSITIVITY
The PA79DK has been qualified according to JEDEC 22-A-113-D, MSL 3. The following conditions were used: IR
reflow for Pb-free assembly profile where: package thickness is greater than 2.5mm, package volume is greater
than 350mm
ELECTROSTATIC DISChARGE
Like many high performance MOSFET amplifiers, the PA79 very sensitive to damage due to electrostatic discharge
(ESD). Failure to follow proper ESD handling procedures could have results ranging from reduced operating per-
formance to catastrophic damage. Minimum proper handling includes the use of grounded wrist or shoe straps,
grounded work surfaces. Ionizers directed at the work in progress can neutralize the charge build up in the work
environment and are strongly recommended.
10
PCB Conditions:
Conditions:
2
, TP = 245°C.
PCB Layers = 4L, Copper, FR–4
PCB Dimensions = 101.6 x 114.3mm
PCB Thickness = 1.6mm
Power dissipation = 2 watts
Ambient Temperature = 55ºC
C
/ C
C
compensation networks close to the amplifier compensation pins. Long
P r o d u c t I n n o v a t i o n F r o m
C
interactions and oscillations.
PA79U