MP400FC Cirrus Logic Inc, MP400FC Datasheet - Page 2

• Manufacturer Part Number: MP400FC
• Description: MODULE PWR AMP HS HV SWITCH MODE
• Manufacturer: Cirrus Logic Inc
• Series: Apex Precision Power™r

Specifications of MP400FC

• Amplifier Type: Power
• Number Of Circuits: 1
• Slew Rate: 350 V/µs
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 8.5pA
• Voltage - Input Offset: 8000µV
• Current - Supply: 700µA
• Current - Output / Channel: 150mA
• Voltage - Supply, Single/dual (±): 10 V ~ 50 V, ±5 V ~ 25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 42-DIP Module
• Description/function: Audio Amplifiers
• Product: Audio Modules
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: 598-1484 - KIT EVALUATION FOR MP400FC
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 598-1483

For Product Information Visit
www.cirrus.com
North America [phone]
Asia Pacific [phone]
Japan [phone]
Europe/UK [phone]
For Applications Assistance
Call Toll-Free [phone]
In the U.S. and Canada
Cirrus Logic – Apex Precision Power
5980 N Shannon Road
Tucson, Arizona U.S.A. 85741-5230
Phone [phone]
Fax [phone]
Product Bulletin Apex Precision Power – MP400 © 2008 Cirrus Logic, Inc. All rights reserved. Cirrus Logic, Cirrus, the Cirrus Logic logo designs, Apex Preci-
sion Power, Apex and the Apex logo designs are trademarks of Cirrus Logic, Inc. Other brand and product names may be trademarks or service marks of their
respective owners.
P r o d u c t I n n o v a t i o n F r o m
Apex Precision Power has been an industry
leader in the design and manufacturing of high
power, precision analog products for more
than two decades. Many Apex products have
traditionally been designed as hybrids in order to
achieve voltage levels up to 1200V and 50A of
output current. Hybrids are known to be very re-
liable, but also costly. To address this cost issue,
Apex re-engineered how a power component
is designed and manufactured. The Apex “open
frame” product technology utilizes low cost sur-
face mount technology (SMT) to reduce per unit
costs by up to 75%.
Traditional hybrid packages achieve exceptional
thermal management by soldering unpack-
aged power transistor die to a BeO (beryllia
oxide) substrate which in turn is soldered to a
The most noticeable physical element of the
“open frame” design is the absence of an enclo-
sure. In the traditional sense, that is. Granted,
these devices are not sealed inside a pack-
age so they do not meet traditional hermetic
requirements. But look closely at the individual
components on the PCB substrate. Each and
every component is enclosed in its own indi-
Save Space: Open Frame Heat Sinking and Board Mounting
A heatsink can be flush mounted to the open frame module above the board to free up board space.
Components can even be mounted on the board under the open frame, as well as underneath the board.
Hybrid Construction
Substrate printing
• Thick film conductive layers
• Resistor layers
Solder reflow substrate to package header
Die epoxy attach
Die epoxy cure
Wire bonding
First yield testing, possible rework
Package welding
Second yield testing
1/4"
Spacing
Open Frame Unit
Open Frame Construction
Solder screening of IMS substrate
Component placement
Reflow
Test
metal base package. In researching lower cost
alternatives, Apex design engineers discovered
how to create a package with a similarly low
thermal resistance at a significant cost savings
by soldering surface mount packaged power
transistors to an insulated metal substrate (IMS).
An IMS substrate consists of an aluminum metal
substrate, a thin insulating layer and a copper
conductive layer. Overall the substrate is similar
to a standard printed circuit board but with far
lower thermal resistance.
The use of SMT construction techniques
generate significant cost efficiencies because
they eliminate a number of costly, time consum-
ing manufacturing steps typically found in the
process intensive, labor intensive assembly of
hybrid components. Here is a comparison:
vidual package. This attribute provides a level
of protection suited to all but the most stringent
operating environments. Customers can also
create their own hermetic enclosure for these
devices. Simply place the component on a board
with other circuit-type components and install
them in a protective cabinet that is hermetically
sealed.
Components can be mounted on board under
the open frame, as well as underneath the board
MP400
www.cirrus.com