LT6001IMS8#TRPBF Linear Technology, LT6001IMS8#TRPBF Datasheet - Page 17

• Manufacturer Part Number: LT6001IMS8#TRPBF
• Description: IC OP AMP DUAL R-R 8-MSOP
• Manufacturer: Linear Technology

Specifications of LT6001IMS8#TRPBF

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.018 V/µs
• Gain Bandwidth Product: 60kHz
• Current - Input Bias: 4nA
• Voltage - Input Offset: 400µV
• Current - Supply: 20µA
• Current - Output / Channel: 10mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 16 V, ±0.9 V ~ 8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -

PACKAGE DESCRIPTIO
3.50 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
0.25 ± 0.05
(2 SIDES)
PIN 1
0.200 REF
U
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
2.38 ±0.05
(2 SIDES)
10-Lead (3mm × 3mm) Plastic DFN
(Reference LTC DWG # 05-08-1699)
0.50
BSC
DD Package
0.675 ±0.05
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
LT6000/LT6001/LT6002
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD10) DFN 1103
17
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