MCP6V02-E/MD Microchip Technology, MCP6V02-E/MD Datasheet - Page 39

• Manufacturer Part Number: MCP6V02-E/MD
• Description: IC OPAMP AUTO-ZERO DUAL 8DFN
• Manufacturer: Microchip Technology

Specifications of MCP6V02-E/MD

• Slew Rate: 0.5 V/µs
• Package / Case: 8-DFN
• Amplifier Type: Chopper (Zero-Drift)
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 1.3MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 2µV
• Current - Supply: 300µA
• Current - Output / Channel: 22mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 130 dB
• Input Offset Voltage: 0.002 mV
• Input Bias Current (max): 1 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 156 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision C (December 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Revision B (June 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
Revision A (September 2007)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
Added the 8-lead, 2x3 TDFN package for the
MCP6V01 and MCP6V03 devices.
Corrected the IMD specification in Table 1-2.
Added 8-lead, 2x3 TDFN package information to
Thermal Characteristic table.
Added information on the Exposed Thermal Pad
(EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4
DFN packages.
Added
Loads”
Other minor typographical corrections.
Updated the specifications and their conditions.
Corrected the Timing Diagrams.
Added to the Test Circuits.
Added R
diagrams.
Added the Typical Performance Curves.
Corrected
Information.
Minor edits due to change in production status.
Added Appendix B, Offset Related Test
Screens.
Section 4.3.6
ISO
and
(see Figure 4-6) to all circuit
REVISION HISTORY
expanded
“Stabilizing
Applications
Output
MCP6V01/2/3
DS22058C-page 41