LT1014ISW#TRPBF Linear Technology, LT1014ISW#TRPBF Datasheet - Page 22

• Manufacturer Part Number: LT1014ISW#TRPBF
• Description: IC OPAMP PRECISION QUAD 16-SOIC
• Manufacturer: Linear Technology
• Type: General Purpose Amplifierr

Specifications of LT1014ISW#TRPBF

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 0.4 V/µs
• Current - Input Bias: 15nA
• Voltage - Input Offset: 200µV
• Current - Supply: 350µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 4 V ~ 44 V, ±2 V ~ 22 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Rail/rail I/o Type: No
• Number Of Elements: 4
• Common Mode Rejection Ratio: 97dB
• Input Offset Voltage: 950uV
• Input Bias Current: 50nA
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): ±15V
• Voltage Gain In Db: 120dB
• Power Supply Rejection Ratio: 100dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 4V
• Single Supply Voltage (max): 44V
• Dual Supply Voltage (min): ±2V
• Dual Supply Voltage (max): ±22V
• Technology: Bipolar
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SOIC W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: Compliant

package DescripTion
LT1013/LT1014

(1.143 – 1.650)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
.045 – .068
FULL LEAD
OPTION
OR TIN PLATE LEADS
(0.203 – 0.457)
CORNER LEADS OPTION
.008 – .018
(7.62 BSC)
.300 BSC
SEATING
PLANE
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
(4 PLCS)
(0.254 – 1.143)
.010 – .045*
OR TIN PLATE LEADS
(0.584 – 1.143)
.023 – .045
HALF LEAD
OPTION
0 – 15
(1.016)
.040
MAX
(1.143 – 1.651)
.045 – .065
(8.509 – 9.398)
(7.747 – 8.509)
(0.203 – 0.457)
.335 – .370
.305 – .335
.008 – .018
DIA
(0.406 – 0.533)
(7.62 BSC)
.300 BSC
.016 – .021**
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(0.360 – 0.660)
(1.270)
MAX
.050
8-Lead TO-5 Metal Can (.200 Inch PCD)
.014 – .026
0 – 15
GAUGE
PLANE
(1.143 – 1.651)
(0.360 – 0.660)
(Reference LTC DWG # 05-08-1320)
(Reference LTC DWG # 05-08-1110)
(Reference LTC DWG # 05-08-1110)
.045 – .065
.014 – .026
OBSOLETE PACKAGES
(12.700 – 19.050)
(4.191 – 4.699)
.165 – .185
.500 – .750
(2.54)
.100
BSC
H Package
J8 Package
J Package
(0.381 – 1.524)
REFERENCE
PLANE
.015 – .060
(5.080)
(3.175)
45
MAX
.200
.125
MIN
**
*
(0.711 – 0.864)
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.028 – .034
RAD TYP
(0.635)
(0.127)
.025
(0.381 – 1.524)
.005
MIN
(2.54)
(2.794 – 4.064)
.100
BSC
INSULATING
.015 – .060
.110 – .160
STANDOFF
(5.080)
14
1
3.175
.200
MAX
.125
MIN
J8 0801
13
2
RAD TYP
(0.635)
.025
(0.127)
.005
MIN
12
3
(19.939)
PIN 1
(0.686 – 1.143)
.785
MAX
11
4
.027 – .045
8
1
(0.406 – 0.610)
H8(TO-5) 0.200 PCD 0204
10
.016 – .024
5
(10.287)
(5.080)
7
2
.200
TYP
.405
MAX
9
6
6
3
8
7
5
4
(5.588 – 7.874)
.220 – .310
(5.588 – 7.874)
J14 0801
.220 – .310
10134fd