AD825ARZ-16-REEL Analog Devices Inc, AD825ARZ-16-REEL Datasheet - Page 5

• Manufacturer Part Number: AD825ARZ-16-REEL
• Description: IC OPAMP JFET GP 26MHZ 16SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD825ARZ-16-REEL

• Amplifier Type: J-FET
• Number Of Circuits: 1
• Slew Rate: 140 V/µs
• Gain Bandwidth Product: 26MHz
• -3db Bandwidth: 46MHz
• Current - Input Bias: 15pA
• Voltage - Input Offset: 1000µV
• Current - Supply: 6.5mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 10 V ~ 36 V, ±5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (R, R-16)
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Specification is for device in free air:
Small Outline (R)
8-lead SOIC package: θ
16-lead SOIC package: θ
JA
JA
= 155°C/W
= 85°C/W
1
Rating
±18 V
See Figure 6
±V
±V
See Figure 6
−65°C to +125°C
−40°C to +85°C
300°C
S
S
Rev. F | Page 5 of 12
2.5
2.0
1.5
1.0
0.5
0
–50
Figure 6. Maximum Power Dissipation vs. Temperature
–40 –30 –20 –10 0
PIN CONFIGURATIONS
+INPUT
–INPUT
8-LEAD SOIC PACKAGE
–V
+IN
–IN
NC
–V
NC
NC
NC
NC
NC
S
S
AMBIENT TEMPERATURE (°C)
1
2
3
4
NC = NO CONNECT
1
2
3
4
5
6
7
8
NC = NO CONNECT
Figure 5. 16-Lead SOIC
Figure 4. 8-Lead SOIC
(Not to Scale)
16-LEAD SOIC PACKAGE
TOP VIEW
(Not to Scale)
AD825
TOP VIEW
AD825
10 20 30
8
7
6
5
16
15
14
13
12
11
10
9
NC
+V
OUTPUT
NC
40
NC
NC
NC
+V
OUTPUT
NC
NC
NC
S
S
50 60 70 80
T
J
= 150°C
AD825
90