MAX4131EUA+ Maxim Integrated Products, MAX4131EUA+ Datasheet - Page 13

• Manufacturer Part Number: MAX4131EUA+
• Description: IC OP AMP SINGLE 8-UMAX
• Manufacturer: Maxim Integrated Products

Specifications of MAX4131EUA+

• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 4 V/µs
• Gain Bandwidth Product: 10MHz
• Current - Input Bias: 50nA
• Voltage - Input Offset: 350µV
• Current - Supply: 1mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 6.5 V, ±1.35 V ~ 3.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Number Of Channels: 1
• Voltage Gain Db: 108 dB
• Common Mode Rejection Ratio (min): 68 dB
• Input Offset Voltage: 1.2 mV
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 1.15 mA
• Maximum Power Dissipation: 330 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 3.25 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details

The MAX4130–MAX4134 operate from a single +2.7V
to +6.5V power supply, or from dual supplies of ±1.35V
to ±3.25V. For single-supply operation, bypass the
power supply with a 0.1µF ceramic capacitor in parallel
with at least 1µF. For dual supplies, bypass each sup-
ply to ground.
Good layout improves performance by decreasing the
amount of stray capacitance at the op amp’s inputs
and outputs. Decrease stray capacitance by placing
external components close to the op amp’s pins, mini-
mizing trace lengths and resistor leads.
Figure 11. Shutdown Output Voltage
Single/Dual/Quad, Wide-Bandwidth, Low-Power,
SHDN
OUT
______________________________________________________________________________________
Power Supplies and Layout
Single-Supply, Rail-to-Rail I/O Op Amps
TIME (1µs/div)
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and the recommended
reflow temperature profile, as well as the latest informa-
tion on reliability testing results, go to Maxim’s website
at www.maxim-ic.com/ucsp and search for the
Application Note: UCSP–A Wafer-Level Chip-Scale
Package.
Figure 12. Shutdown Enable/Disable Supply Current
UCSP Applications Information
500µA/div
CURRENT
SUPPLY
1V/div
SHDN
TIME (1µs/div)
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