LM2904DR2G ON Semiconductor, LM2904DR2G Datasheet - Page 13
LM2904DR2G
Manufacturer Part Number
LM2904DR2G
Description
IC OPAMP DUAL LOW POWER 8SOIC
Manufacturer
ON Semiconductor
Datasheet
1.LM2904NG.pdf
(14 pages)
Specifications of LM2904DR2G
Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
0.6 V/µs
Gain Bandwidth Product
1MHz
Current - Input Bias
45nA
Voltage - Input Offset
2000µV
Current - Supply
1.5mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
3 V ~ 32 V, ±1.5 V ~ 16 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Number Of Channels
2
Common Mode Rejection Ratio (min)
50 dB
Input Voltage Range (max)
Positive Rail - 5.7 V
Input Voltage Range (min)
Negative Rail
Input Offset Voltage
7 mV
Input Bias Current (max)
250 nA
Output Current (typ)
40 mA
Operating Supply Voltage
32 V
Supply Current
1.2 mA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage
+/- 16 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
32 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
LM2904DR2GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM2904DR2G
Manufacturer:
ON
Quantity:
50 000
Company:
Part Number:
LM2904DR2G
Manufacturer:
ON
Quantity:
657
Company:
Part Number:
LM2904DR2G
Manufacturer:
ON Semiconductor
Quantity:
6 850
Part Number:
LM2904DR2G
Manufacturer:
ON
Quantity:
20 000
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
M
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
http://onsemi.com
M
N
CASE 751−07
X 45
SOIC−8 NB
ISSUE AJ
_
M
13
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
A
B
C
D
G
H
K
M
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_