LTC2912HDDB-1#TRMPBF Linear Technology, LTC2912HDDB-1#TRMPBF Datasheet - Page 11

• Manufacturer Part Number: LTC2912HDDB-1#TRMPBF
• Description: IC VOLT MONITOR SNGL 8-DFN
• Manufacturer: Linear Technology
• Type: Simple Reset/Power-On Resetr

Specifications of LTC2912HDDB-1#TRMPBF

• Number Of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Reset Timeout: Adjustable/Selectable
• Voltage - Threshold: Adjustable/Selectable
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
2.55 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
1.15 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.85 MAX
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
0.20 BSC
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
2.62 REF
DATUM ‘A’
2.20 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
MAX
0.52
0.50 BSC
PER IPC CALCULATOR
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.30 – 0.50 REF
0.70 ±0.05
PACKAGE
OUTLINE
0.65
REF
(Reference LTC DWG # 05-08-1702 Rev B)
(SEE NOTE 6)
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
8-Lead Plastic DFN (3mm × 2mm)
1.22 REF
(Reference LTC DWG # 05-08-1637)
1.4 MIN
TOP MARK
PIN 1 BAR
8-Lead Plastic TSOT-23
0.200 REF
0.09 – 0.20
(NOTE 3)
TS8 Package
DDB Package
2.80 BSC
3.00 ±0.10
(2 SIDES)
1.00 MAX
1.50 – 1.75
(NOTE 4)
0.80 – 0.90
0.65 BSC
0.75 ±0.05
2.00 ±0.10
(2 SIDES)
PIN ONE ID
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
2.90 BSC
(NOTE 4)
1.95 BSC
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
TS8 TSOT-23 0802
LTC2912
0.01 – 0.10
0.22 – 0.36
8 PLCS (NOTE 3)
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
11
2912fa