MC34064D-005G ON Semiconductor, MC34064D-005G Datasheet - Page 10

• Manufacturer Part Number: MC34064D-005G
• Description: IC SENSOR UNDERVOLTAGE 8SOIC
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MC34064D-005G

• Number Of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Voltage - Threshold: 4.6V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Monitored Voltage: 4.6 V
• Undervoltage Threshold: 4.61 V
• Overvoltage Threshold: 4.7 V
• Manual Reset: No
• Watchdog: No
• Power-up Reset Delay (typ): Adj
• Supply Voltage (max): 6.5 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 390 uA
• Maximum Power Dissipation: 625 mW
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 70 C
• Internal Hysteresis: Yes
• Minimum Operating Temperature: 0 C
• Operating Temperature Range: 0 C to + 70 C
• Output Type: Open Collector / Drain
• Current, Output: 27 mA
• Current, Supply: 390 μA
• Package Type: SOIC-8
• Power Dissipation: 625 mW
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Output: 10 V
• Voltage, Supply: 1 to 6.5 V
• Voltage Supervisor Type: Voltage Detector
• Number Of Voltage Supervisors: 1
• Monitored Supervisor Voltage: 4.61
• Reset Threshold Voltage (min): 4.5V
• Reset Threshold Voltage (max): 4.7V
• Operating Supply Voltage (min): 1V
• Operating Supply Voltage (max): 6.5V
• Operating Temperature Classification: Commercial
• Operating Temp Range: 0C to 70C
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reset Timeout: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC34064D-005GOS

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
*For additional information on our Pb−Free strategy and soldering
C
B
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
0.037
C A B
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
SN SUFFIX
ISSUE H
TSOP−5
K
0.074
1.9
10
DETAIL Z
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
inches
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
mm
DIM
M
A
B
C
D
G
H
K
L
S
J
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_