MCP1700T-5002E/TT Microchip Technology, MCP1700T-5002E/TT Datasheet - Page 18

• Manufacturer Part Number: MCP1700T-5002E/TT
• Description: IC LDO REG 200MA 5.0V SOT-23-3
• Manufacturer: Microchip Technology

Specifications of MCP1700T-5002E/TT

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.178V @ 250mA
• Number Of Regulators: 1
• Current - Output: 250mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 6 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 350 mV
• Output Current: 250 mA
• Line Regulation: 0.75 % / V
• Load Regulation: 1 %
• Voltage Regulation Accuracy: 3 %
• Maximum Power Dissipation: 0.3696 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP1700T5002ETTRTR; MCP1700T5002ETTRTR; MCP1700T5002ETTTR

MCP1700
DS21826B-page 18
3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]
Notes:
1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
e
E
Number of Pins
Pitch
Bottom to Package Flat
Overall Width
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
N
R
b
A
L
c
1 2
3
Dimension Limits
Units
N
D
E
A
R
e
L
b
c
MIN
.125
.175
.170
.080
.500
.014
.014
.050 BSC
INCHES
Microchip Technology Drawing C04-101B
3
MAX
.165
.205
.210
.105
.021
.022
© 2007 Microchip Technology Inc.
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D