MCP1703T-3302E/CB Microchip Technology, MCP1703T-3302E/CB Datasheet
MCP1703T-3302E/CB
Specifications of MCP1703T-3302E/CB
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MCP1703T-3302E/CB Summary of contents
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... AN765, “Using Microchip’s Micropower LDOs”, DS00765, Microchip Technology Inc., 2002 • AN766, “Pin-Compatible CMOS Upgrades to BiPolar LDOs”, DS00766, Microchip Technology Inc., 2002 • AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001 3-Pin SOT-89 SOT-223 ...
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... MCP1703 Functional Block Diagrams V IN Overcurrent Overtemperature Typical Application Circuits + Battery 1 µF Ceramic DS22049A-page 2 MCP1703 Error Amplifier +V IN Voltage - Reference + GND MCP1703 V OUT GND V OUT V OUT 3.3V I OUT OUT 1 µF Ceramic © 2007 Microchip Technology Inc. ...
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... Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2007 Microchip Technology Inc. † Notice: Stresses above those listed under “Maximum Rat- ings” may cause permanent damage to the device. This is a ...
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... I = 100 µA, OUT 100 mV pk-pk µF, INAC 1. DROPOUT(MAX) = 100 µA. OUT . OUT Conditions EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board 0.100 sq in copper on both sides of 2 sided board, with vias © 2007 Microchip Technology Inc. ...
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... Quiescent Current vs. Input Voltage. 6.00 5.00 4.00 -45°C +130°C 3.00 +90°C 2.00 1. Input Voltage (V) FIGURE 2-3: Quiescent Current vs. Input Voltage. © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT or 2.7V, whichever is greater. 120 = 1. µA 100 FIGURE 2-4: Current. 120 ...
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... Output Voltage vs. Load 2.5V OUT +25°C +90°C 0°C +130°C -45°C 50 100 150 200 250 Load Current (mA) Output Voltage vs. Load 5.0V +90°C OUT +130°C 0°C -45°C +25°C 50 100 150 200 250 Load Current (mA) Output Voltage vs. Load © 2007 Microchip Technology Inc. ...
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... Load Current (mA) FIGURE 2-14: Dropout Voltage vs. Load Current. FIGURE 2-15: Dynamic Line Response. © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT or 2.7V, whichever is greater. +0°C FIGURE 2-16: 900 800 700 600 500 ...
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... Temperature (°C) Line Regulation vs 5.0V OUT V = 6.0V to 16.0V IN 250 mA 100 mA - 105 130 Temperature (°C) Line Regulation vs. V =1. =2. 100 mV p-p INAC C =0 μ =100 µA OUT 0 100 1000 Frequency (kHz) PSRR vs. Frequency. © 2007 Microchip Technology Inc. ...
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... V =2. 0.01 0.001 0.01 0 Frequency (kHz) FIGURE 2-26: Output Noise vs. Frequency. FIGURE 2-27: Power Up Timing. © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT or 2.7V, whichever is greater. 100 1000 FIGURE 2-28: I =50 mA OUT 100 1000 FIGURE 2-29: MCP1703 = 1 µF Ceramic (X7R 100 µ ...
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... OUT requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electro- lytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at high- frequency. Function ) IN to the input unregulated source voltage. © 2007 Microchip Technology Inc. ...
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... V IN Overcurrent Overtemperature FIGURE 4-1: Block Diagram. © 2007 Microchip Technology Inc. 4.3 Overtemperature The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 150° ...
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... Output Rise time When powering up the internal reference output, the typical output rise time of 1000 µs is controlled to prevent overshoot of the output voltage. ≥ 2.5V). For applications R © 2007 Microchip Technology Inc. ...
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... MCP1703, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (Rθ ). The thermal resistance from junction to JA ambient for the SOT-23A pin package is estimated at 336 C/W. ° © 2007 Microchip Technology Inc. EQUATION 6- MAX Where: T J(MAX) P TOTAL Rθ ...
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... MCP1703 MCP1703 is 500 JRISE A(MAX Ratio Metric Reference ® PIC Microcontroller V V OUT REF C OUT 1 µF ADO AD1 Using the MCP1703 The typical current limit for the +25°C). A © 2007 Microchip Technology Inc. ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. Extended Temp Voltage * Symbol Voltage * 1 ...
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... E 2.10 E1 1.20 D 2.70 L 0.15 φ 0° c 0.09 b 0.30 φ L NOM MAX 3 – 1.45 – 1.30 – 0.15 – 3.00 – 1.80 – 3.10 – 0.60 – 30° – 0.26 – 0.51 Microchip Technology Drawing C04-130B © 2007 Microchip Technology Inc. ...
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... Leads 1 & 3 Width Notes: 1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc ...
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... D 6.30 c 0.23 b 0.60 b2 2.90 L 0.75 φ 0° c NOM MAX 3 – 1.80 – 0.10 1.60 1.70 7.00 7.30 3.50 3.70 6.50 6.70 0.30 0.35 0.76 0.84 3.00 3.10 – – – 10° Microchip Technology Drawing C04-032B © 2007 Microchip Technology Inc. ...
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... APPENDIX A: REVISION HISTORY Revision A (June 2007) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1703 DS22049A-page 19 ...
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... MCP1703 NOTES: DS22049A-page 20 © 2007 Microchip Technology Inc. ...
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... MCP1703T-1802E/XX: Tape and Reel, 1.8V MCP1703T-2502E/XX: Tape and Reel, 2.5V MCP1703T-2802E/XX: Tape and Reel, 2.8V MCP1703T-3002E/XX: Tape and Reel, 3.0V MCP1703T-3302E/XX: Tape and Reel, 3.3V MCP1703T-3602E/XX: Tape and Reel, 3.6V MCP1703T-4002E/XX: Tape and Reel, 4.0V MCP1703T-5002E/XX: Tape and Reel, 5.0V CB for 3LD SOT-23A package ...
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... MCP1703 NOTES: DS22049A-page 22 © 2007 Microchip Technology Inc. ...
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... PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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