MCP1790-3002E/DB Microchip Technology, MCP1790-3002E/DB Datasheet - Page 18

• Manufacturer Part Number: MCP1790-3002E/DB
• Description: IC LDO REG 70MA 3.0V SOT-223-3
• Manufacturer: Microchip Technology

Specifications of MCP1790-3002E/DB

• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Regulator Topology: Positive Fixed
• Voltage - Output: 3V
• Voltage - Input: 6 ~ 30 V
• Voltage - Dropout (typical): 0.7V @ 70mA
• Number Of Regulators: 1
• Current - Output: 70mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 30 V
• Output Voltage: 3 V
• Output Type: Fixed
• Dropout Voltage (max): 1.3 V at 70 mA
• Output Current: 70 mA
• Line Regulation: +/- 0.0002 % / V
• Load Regulation: +/- 0.2 %
• Voltage Regulation Accuracy: 2.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP1790/MCP1791
5.0
5.1
The MCP1790/MCP1791 is most commonly used as a
voltage regulator. It’s high voltage input capability and
thermal protection make it ideal for automotive and 24V
industrial applications.
FIGURE 5-1:
5.1.1
5.2
5.2.1
The internal power dissipation of the MCP1790/
MCP1791 is a function of input voltage, output voltage
and output current. The power dissipation, as a result
of the quiescent current draw, is so low, it is insignifi-
cant (70.0 µA x V
used to calculate the internal power dissipation of the
LDO.
EQUATION 5-1:
The
temperature specified for the MCP1790/MCP1791 is
+125
of the MCP1790/MCP1791, the total internal power
dissipation is multiplied by the thermal resistance from
junction to ambient (Rθ
junction to ambient for the SOT-223-5 package is
estimated at 62
DS22075A-page 18
24 VDC
V
Input Voltage Range = 8V to 24V
V
P
V
OUT(MIN)
IN
°
LDO
IN(MAX)
C
maximum
P
.
5
To estimate the internal junction temperature
APPLICATION CIRCUITS /
ISSUES
Typical Application
Power Calculations
LDO
Package Type = SOT-223-5
V
=
V
IN
1N4002
APPLICATION INPUT CONDITIONS
POWER DISSIPATION
OUT
(
maximum = 24V
V
Ceramic
IN MAX )
= LDO Pass device internal power
= Maximum input voltage
= LDO minimum output voltage
°
C/W.
1 µF
C
typical = 5.0V
(
1
IN
IN
dissipation
I
OUT
continuous
MCP1791
). The following equation can be
2
+
Typical Application.
)
JA
–
3
). The thermal resistance from
= 70 mA maximum
V
OUT MIN
4
+
4.7 µF Ceramic
C
5
OUT
(
10 kΩ
operating
)
) I
×
PWRGD
OUT MAX )
V
OUT
5V@70 mA
(
junction
)
EQUATION 5-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 5-3:
EQUATION 5-4:
EQUATION 5-5:
P
T
T
T
P
T
D(MAX)
A(MAX)
J(MAX)
J(MAX)
TOTAL
T
T
AMAX
Rθ
Rθ
P
J(RISE)
J(RISE)
TOTAL
Rθ
JA
JA
T
T
T
JA
J MAX
P
A
J
(
T
D MAX
=
=
=
=
=
=
=
=
J RISE
(
(
= Rise in device junction
= Maximum device power
= Thermal resistance from
= Junction Temperature.
= Rise in device junction
= Ambient temperature.
)
Maximum continuous junction
temperature.
Total device power dissipation.
Thermal resistance from junction
to ambient.
Maximum ambient temperature.
Maximum device power
dissipation.
Maximum continuous junction
temperature.
Maximum ambient temperature.
Thermal resistance from junction
to ambient.
T
=
)
temperature over the ambient
temperature.
dissipation.
junction-to-ambient.
temperature over the ambient
temperature.
J
)
=
P
=
=
TOTAL
(
---------------------------------------------------
P
T
© 2008 Microchip Technology Inc.
T
J RISE
D MAX
J MAX
(
(
(
×
Rθ
Rθ
)
)
)
+
–
×
JA
JA
T
T
Rθ
A
A MAX
+
(
JA
T
AMAX
)
)