BA033CC0FP-E2 Rohm Semiconductor, BA033CC0FP-E2 Datasheet - Page 7

• Manufacturer Part Number: BA033CC0FP-E2
• Description: IC REG LDO 1A 3.3V TO252
• Manufacturer: Rohm Semiconductor

Specifications of BA033CC0FP-E2

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 25V
• Voltage - Dropout (typical): 0.3V @ 500mA
• Number Of Regulators: 1
• Current - Output: 1A (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-252-2, DPak (2 Leads + Tab), TO-252AA, SC-63
• Number Of Outputs: 1
• Polarity: Positive
• Output Voltage: 3.3 V
• Output Type: Fixed
• Dropout Voltage (max): 0.5 V at 500 mA
• Output Current: 1 A
• Line Regulation: 100 mV
• Load Regulation: 150 mV
• Voltage Regulation Accuracy: 2 %
• Maximum Power Dissipation: 1.2 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

●Thermal Design
BA□□DD0T
BA□□DD0WT
© 2011 ROHM Co., Ltd. All rights reserved.
www.rohm.com
10
9
8
7
6
5
4
3
2
1
0
0
Board size : 70×70×1.6 ㎜
Board front copper foil area : 10.5×10.5 ㎜
①2-layer board (back surface copper foil area :15×15 ㎜
②2-layer board (back surface copper foil area :70×70 ㎜
③4-layer board (back surface copper foil area :70×70 ㎜
③7.3W
②5.5W
①2.3W
HRP-5
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The
IC characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature Tj
and long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from
thermal damage, it is necessary to operate it at temperatures lower than the maximum junction temperature Tj
Fig.30 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The method of calculating the power consumption Pc(W) is as follows.
Solving this for load current IO in order to operate within the acceptable loss:
It is then possible to find the maximum load current Io
・Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
25
Pc = (Vcc-Vo) × Io ＋ Vcc × Icca
Acceptable loss Pd≦Pc
Io≦
Io≦
Io≦200mA (Icca : 2mA)
Pc=Vcc×(Icca＋Ishort)
Ambient temperature:Ta( ℃）
Series
Pd – Vcc×Icca
1.04－8.3×Icca
50
Series
Vcc－Vo
Fig.29
,BA□□CC0T
3
75
,BA□□DD0HFP
(board contains a thermal via)
5
100
MAX
2
., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction
125
Series
(Please refer to Figs.8 and 20 for Icca.)
2
2
2
)
)
)
150
,BA□□CC0FP
Series
*Ishort : Short circuit current
,BA□□CC0WT
With the IC alone : θja=62.5℃/W → -16mW/℃
25℃=2000mW → 85℃=1040mW
25
20
15
10
5
0
0
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
(1)20.0
(2)2.0
TO220FP-5
25
Series
MAX
Ambient temperature:Ta(℃）
50
Series
with respect to the applied voltage Vcc at the time of thermal design.
7/11
Fig.30
75
,BA□□CC0WFP
100
125
150
Vcca：
Series
Vcc：
Vo：
Io：
Input voltage
Output voltage
Load current
Circuit current
2.0
1.6
1.2
0.8
0.4
0.0
0
TO252-5
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
1.30
25
Ambient temperature:Ta( ℃）
50
Technical Note
Fig.31
2011.03 - Rev.C
75
MAX
100
of the IC.
125
150