MIC5209-3.3BM Micrel Inc, MIC5209-3.3BM Datasheet - Page 5

• Manufacturer Part Number: MIC5209-3.3BM
• Description: IC REG LDO 500MA 3.3V LN 8SOIC
• Manufacturer: Micrel Inc

Specifications of MIC5209-3.3BM

• Mounting Type: Surface Mount
• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 16V
• Voltage - Dropout (typical): 0.35V @ 500mA
• Number Of Regulators: 1
• Current - Output: 500mA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• No. Of Pins: 8
• Peak Reflow Compatible (260 C): No
• Supply Voltage: 60V
• Output Voltage: 3.3V
• Current Rating: 500A
• Output Voltage Max: 3.3V
• Leaded Process Compatible: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Lead free / RoHS Compliant

ENABLE Input
V
I
I
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation at any T
3. The maximum allowable power dissipation at any T
3. The maximum allowable power dissipation at any T (ambient temperature) is calculated using: P
4. Output voltage temperature coeffi cient is the worst case voltage change divided by the total temperature range.
5. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
6. Dropout voltage is defi ned as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differen-
7. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load
8. V
9. Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation ef-
10. C
June 2006
ENL
ENL
ENL
ENH
ENL
ENL
ENL
maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. See Table 1 and the
“Thermal Considerations” section for details.
“Thermal Considerations” section for details.
“Thermal Considerations”
from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specifi cation.
tial.
current plus the ground pin current.
fects. Specifi cations are for a 500mA load pulse at V
only].
EN
BYP
is the voltage externally applied to devices with the EN (enable) input pin. [SO-8 (M) and TO-263-5 (U) packages only.]
is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin. [SO-8 (M) and TO-263-5 (U) packages
Enable Input Logic-Low Voltage
Enable Input Logic-Low Voltage
Enable Input Logic-Low Voltage
Enable Input Logic-Low Voltage
Enable Input Current
Enable Input Current
Enable Input Current
Enable Input Current
A
A
A
A
IN
(ambient temperature) is calculated using: P
= 16V for t = 10ms.
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
EN
EN
ENL
ENL
ENL
ENL
ENL
ENL
ENH
ENH
= logic low (regulator shutdown)
= logic low (regulator shutdown)
= logic low (regulator shutdown)
= logic low (regulator shutdown)
= logic low (regulator shutdown)
= logic high (regulator enabled)
= logic high (regulator enabled)
= logic high (regulator enabled)
= logic high (regulator enabled)
= logic high (regulator enabled)
≤ 0.4V
≤ 0.4V
≤ 0.4V
≤ 0.4V
≤ 0.4V
≤ 0.4V
≤ 0.18V
≤ 0.18V
≤ 0.18V
= 2.0V
= 2.0V
= 2.0V
= 2.0V
= 2.0V
= 16V
= 16V
= 16V
= 16V
= 16V
5
D
(max) = (T
J
(max) – T
(max) – T
(max) – T ) ÷ θ
2.0
2.0
2.0
2.0
2.0
A
A
0.01
0.01
0.01
0.01
0.01
0.01
0.01
5
5
5
5
5
JA
. Exceeding the
0.18
0.4
0.4
0.4
0.4
0.4
–1
–1
–1
–1
–1
–1
–2
20
20
20
20
20
25
25
25
25
25
25
30
30
30
30
30
50
M9999-060906
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V
V
V