SP3003-04JTG Littelfuse Inc, SP3003-04JTG Datasheet

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SP3003-04JTG

Manufacturer Part Number
SP3003-04JTG
Description
TVS ARRAY ESD 4CH 0.65PF SC70-6
Manufacturer
Littelfuse Inc
Series
SPA SP3003r
Datasheet

Specifications of SP3003-04JTG

Package / Case
SC-70-6, SC-88, SOT-363
Voltage - Reverse Standoff (typ)
6V
Polarization
4 Channel Array - Bidirectional
Mounting Type
Surface Mount
Applications
General Purpose
Number Of Circuits
4
Voltage - Working
5V
Technology
Diode Array
Clamping Voltage
11.8 V
Current Rating
2.5 A
Operating Voltage
6 V
Channels
4 Channels
Breakdown Voltage
6 V
Capacitance
0.65 pF
Termination Style
Solder Pad
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Clamping
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
F2917TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SP3003-04JTG
Manufacturer:
LITTELFUSE/力特
Quantity:
20 000
HF
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
I/O1
Pinout
Functional Block Diagram
GND
NC
V
CC
RoHS
SP3003-02
V
GND
CC
SP3003-02X/J
I/O 4
I/O 1
I/O 2
I/O 3
V
CC
Pb
I/O2
GREEN
I/O 1
I/O 2
SP3003-04A
I/O1
SP3003 Lead-Free/Green Series
I/O 2
GND
I/O 1
I/O2
SP3003-04
SP3003-04X/J
V
GND
CC
NC
NC
SPA™ Silicon Protection Array Products
GND
NC
NC
Low Capacitance ESD Protection Array
I/O3
I/O 4
I/O 3
V
CC
I/O4
Revised: August 19, 2010
65
Description
The SP3003 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation. Their very low
loading capacitance also makes them ideal for protecting
high speed signal pins such as HDMI, DVI, USB2.0, and
IEEE 1394.
Features
Applications
0.65pF (TYP) per I/O
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
IEC61000-4-4, 40A
(5/50ns)
0.5μA (MAX) at 5V
board space (SC70,
SOT553, SOT563,
MSOP10)
IEC61000-4-5, 2.5A
(8/20μs)
SP3003 Lead-Free/Green Series

Related parts for SP3003-04JTG

SP3003-04JTG Summary of contents

Page 1

... SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Description The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD) ...

Page 2

... Reverse Standoff Voltage V RWM Reverse Leakage Current I LEAK 1 Clamp Voltage V C ESD Withstand Voltage 1 V ESD 1 Diode Capacitance C Diode Capacitance 1 C I/O-I/O SP3003 Lead-Free/Green Series Parameter Rating -65 to 150 150 260 Test Conditions Min I ≤ 1μ = =1A, t =8/20μs, Fwd =2A, t =8/20μs, Fwd ...

Page 3

... Low Capacitance ESD Protection Array Capacitance vs. Bias Voltage 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 0.0 0.5 1.E+09 1.E+10 1.E+09 67 Revised: August 19, 2010 V = Float 3. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) SP3003 Lead-Free/Green Series ...

Page 4

... Average ramp up rate (Liquidus) Temp ( peak Ramp-up Rate S(max Temperature (T ) (Liquidus) L Reflow - Temperature ( Peak Temperature ( Time within 5°C of actual peak Temperature ( Ramp-down Rate Time 25°C to peak Temperature ( not exceed SP3003 Lead-Free/Green Series D2+ Gnd D2 SP300x- D1+ Gnd D1- HDMI or DVI Connector D0+ Gnd D0 SP300x- Clk+ ...

Page 5

... Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 0.17 0.27 0.007 0.011 0.08 0.18 0.003 0.007 1.50 1.70 0.059 0.067 1.10 1.30 0.043 0.051 0.50 BSC 0.020 BSC 0.10 0.30 0.004 0.012 1.50 1.70 0.059 0.067 SP3003 Lead-Free/Green Series ...

Page 6

... Solder Pad Layout Package Dimensions — MSOP10 Part Numbering System SP3003- Silicon G= Green Protection Array T= Tape & Reel Series Package A = MSOP-10, 3000 quantity Number of Channels J = SC70-5 or SC70-6, 3000 quantity - channel X = SOT553 or SOT563, 5000 quantity (SC70-5, SOT553 packages) - channel (SC70-6, SOT563, MSOP-10 packages) ...

Page 7

... Ordering Information Part Number SP3003-02JTG SP3003-02XTG SP3003-04ATG SP3003-04JTG SP3003-04XTG Embossed Carrier Tape & Reel Specifications - SC70-5 and SC70-6 Embossed Carrier Tape & Reel Specifications - SOT553 and SOT563 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. ...

Page 8

... SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - MSOP-10 SP3003 Lead-Free/Green Series Millimetres Min Max E 1.65 1.85 F 5.40 5.60 D 1.50 1.60 D1 1.50 Min P0 3.90 4.10 10P0 40.0+/- 0.20 W 11.90 12. .90 8. ...

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