LP2951CD-3.0G ON Semiconductor, LP2951CD-3.0G Datasheet - Page 20

• Manufacturer Part Number: LP2951CD-3.0G
• Description: IC REG LDO 100MA 3V 8-SOIC
• Manufacturer: ON Semiconductor

Specifications of LP2951CD-3.0G

• Regulator Topology: Positive Fixed
• Voltage - Output: 3V
• Voltage - Input: Up to 30V
• Voltage - Dropout (typical): 0.35V @ 100mA
• Number Of Regulators: 1
• Current - Output: 100mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

L3
L4
b2
e
1
b3
4
2
E
3
b
D
A
0.005 (0.13)
B
M
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
c
0.228
5.80
L2
A
GAUGE
PLANE
PACKAGE DIMENSIONS
ROTATED 90 CW
c2
DETAIL A
SOLDERING FOOTPRINT*
H
C
L
http://onsemi.com
0.244
6.20
CASE 369C−01
L1
DT SUFFIX
ISSUE D
5
DPAK
20
0.102
2.58
A1
H
0.118
3.00
0.063
1.60
C
SCALE 3:1
Z
SEATING
PLANE
0.243
6.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
5. DIMENSIONS D AND E ARE DETERMINED AT THE
6. DATUMS A AND B ARE DETERMINED AT DATUM
inches
Y14.5M, 1994.
MENSIONS b3, L3 and Z.
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
OUTERMOST EXTREMES OF THE PLASTIC BODY.
PLANE H.
mm
DIM
A1
b2
b3
c2
L1
L2
L3
L4
A
D
H
b
c
E
e
L
Z
0.086
0.000
0.025
0.030
0.180
0.018
0.018
0.235
0.250
0.370
0.055
0.035
0.155
MIN
0.090 BSC
0.020 BSC
−−−
0.108 REF
INCHES
0.094
0.005
0.035
0.045
0.215
0.024
0.024
0.245
0.265
0.410
0.070
0.050
0.040
MAX
−−−
MILLIMETERS
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
9.40
1.40
0.89
3.93
MIN
−−−
2.29 BSC
2.74 REF
0.51 BSC
10.41
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
1.78
1.27
1.01
−−−