NUP4301MR6T1G ON Semiconductor, NUP4301MR6T1G Datasheet

IC TVS DIODE ARRAY 70V 6-TSOP

NUP4301MR6T1G

Manufacturer Part Number
NUP4301MR6T1G
Description
IC TVS DIODE ARRAY 70V 6-TSOP
Manufacturer
ON Semiconductor
Datasheet

Specifications of NUP4301MR6T1G

Voltage - Breakdown
70V
Polarization
4 Channel Array - Bidirectional
Mounting Type
Surface Mount
Package / Case
SC-74-6
Applications
General Purpose
Number Of Circuits
1
Voltage - Working
70V
Technology
Diode Array
Product
Ultra Fast Recovery Rectifier
Configuration
Octal
Reverse Voltage
70 V
Forward Voltage Drop
1.25 V @ 0.15 A
Forward Continuous Current
0.715 A
Max Surge Current
2 A
Reverse Current Ir
2.5 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Clamping
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NUP4301MR6T1GOS
NUP4301MR6T1GOS
NUP4301MR6T1GOSTR

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NUP4301MR6T1
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
Applications
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0  0.75  0.062 in.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 3
Reverse Voltage
Forward Current
Peak Forward Surge Current
Repetitive Peak Reverse Voltage
Average Rectified Forward
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Current
NUP4301MR6T1 is a MicroIntegrationt device designed to
Low Capacitance (1.5 pf Maximum Between I/O Lines)
Single Package Integration Design
Provides ESD Protection for JEDEC Standards JESD22
Protection for IEC61000−4−2 (Level 4)
Ensures Data Line Speed and Integrity
Fewer Components and Less Board Space
Direct the Transient to Either Positive Side or to the Ground
Pb−Free Package is Available
USB 1.1 and 2.0 Data Line Protection
T1/E1 Secondary IC Protection
T3/E3 Secondary IC Protection
HDSL, IDSL Secondary IC Protection
Video Line Protection
Microcontroller Input Protection
Base Stations
I
2
Current (Note 1)
(averaged over any 20 ms period)
t = 1.0 ms
t = 1.0 ms
t = 1.0 S
C Bus Protection
Machine Model = Class C
Human Body Model = Class 3B
8.0 kV (Contact)
15 kV (Air)
Rating
(Each Diode) (T
J
= 25°C unless otherwise noted)
I
Symbol
FM(surge)
V
I
I
I
F(AV)
FRM
FSM
V
RRM
I
F
R
Value
200
500
715
450
2.0
1.0
0.5
70
70
1
mAdc
mAdc
Unit
Vdc
mA
mA
V
A
†For information on tape and reel specifications,
NUP4301MR6T1
NUP4301MR6T1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation may vary depending
upon manufacturing location.
(Note: Microdot may be in either location.
Device
1/O 3
I/O 1
V
ORDERING INFORMATION
N
64
M
G
PIN CONFIGURATION
2
MARKING DIAGRAM
http://onsemi.com
AND SCHEMATIC
1
6
CASE 318F
= Device Code
= Date Code*
= Pb−Free Package
(Pb−Free)
PLASTIC
Package
TSOP−6
TSOP−6
TSOP−6
5
64M G
4
Publication Order Number:
G
1
2
3
NUP4301MR6T1/D
3000/Tape & Reel
3000/Tape & Reel
Shipping
6 I/O
5 V
4 I/O
P

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NUP4301MR6T1G Summary of contents

Page 1

... ORDERING INFORMATION Device Package Shipping NUP4301MR6T1 TSOP−6 3000/Tape & Reel NUP4301MR6T1G TSOP−6 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...

Page 2

THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Ambient Lead Solder Temperature, Maximum 10 Seconds Duration Junction Temperature Storage Temperature ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS = 100 mA) Reverse Breakdown Voltage (I (BR) Reverse Voltage Leakage Current Capacitance (between I/O pins ...

Page 3

... A1 0.95 0.037 1.9 0.075 0.95 0.037 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NUP4301MR6T1 PACKAGE DIMENSIONS TSOP−6 CASE 318F−05 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14 ...

Page 4

... Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NUP4301MR6T1 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: http://onsemi ...

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