NUP4304MR6T1 ON Semiconductor, NUP4304MR6T1 Datasheet - Page 6

• Manufacturer Part Number: NUP4304MR6T1
• Description: IC DIODE ARRAY LO CAP ESD SC74-6
• Manufacturer: ON Semiconductor

Specifications of NUP4304MR6T1

• Voltage - Breakdown: 70V
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Applications: General Purpose
• Number Of Circuits: 4
• Voltage - Working: 70V
• Technology: Diode Array
• Product: Standard Recovery Rectifier
• Configuration: Octal
• Reverse Voltage: 70 V
• Forward Voltage Drop: 1.25 V at 0.15 A
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.5 A
• Reverse Current Ir: 2.5 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: No RoHS Version Available

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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0.05 (0.002)
H
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
D
5
2
3
4
*For additional information on our Pb−Free strategy and soldering
0.028
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.7
b
A
E
0.074
1.9
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
0.039
http://onsemi.com
1.0
L
CASE 318F−05
ISSUE M
TSOP−6
0.094
C
2.4
6
q
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318F−01, −02, −03 OBSOLETE. NEW
DIM
A1
H
A
D
E
b
c
e
L
q
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
STANDARD 318F−04.
E
inches
0.037
0.037
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
mm
MIN
0.95
0.95
0°
MILLIMETERS
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
0°
NUP4303MR6/D
INCHES
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
NOM
−
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°