CRCW0805332RFKEA Vishay, CRCW0805332RFKEA Datasheet - Page 6

• Manufacturer Part Number: CRCW0805332RFKEA
• Description: RES 332 OHM 1/8W 1% 0805 SMD
• Manufacturer: Vishay
• Series: CRCWr
• Type: Thick Filmr

Specifications of CRCW0805332RFKEA

• Resistance: 332Ohm
• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 332
• Power (watts): 0.125W, 1/8W
• Composition: Thick Film
• Tolerance: ±1%
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 0805 (2012 Metric)
• Resistance In Ohms: 332
• Case: 0805 (2012 metric)
• Power Rating(s): 1/8W
• Tolerance (+ Or -): 1%
• Mounting Style: Surface Mount
• Operating Temp Range: -55C to 155C
• Case Style: Molded
• Military Standard: Not Required
• Failure Rate: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 0.45mm
• Resistance Tolerance: ± 1%
• Power Rating: 125mW
• Voltage Rating: 150V
• Resistor Element Material: Thick Film
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 155 C
• Dimensions: 1.25 mm W x 2 mm L x 0.45 mm H
• Product: Thick Film Resistors SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: 541-332CTR; D12/CRCW0805 100 332R 1% ET1 E3

D/CRCW e3
Vishay
www.vishay.com
116
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
58 (Td)
14 (Na)
30 (Db)
30 (Db)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Damp heat, cyclic
Damp heat, cyclic
Rapid change of
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
Lead (Pb)-Free Thick Film, Rectangular Chip Resistors
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) °C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C; ≥ 90 % RH;
55 °C; ≥ 90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) °C
PROCEDURE
24 h; 5 cycles
U =
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) °C
1000 cycles
≤ 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
≤ U
; 60 s
;
x R
max.
;
[e-mail]
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 Ω)
SIZE 0402 to 2512
PERMISSIBLE CHANGE (ΔR)
Good tinning (≥ 95 % covered)
Good tinning (≥ 95 % covered)
No flashover or breakdown
No visible damage
REQUIREMENTS
no visible damage
no visible damage
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
± 5 %
Document Number: 20035
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
Revision: 02-Dec-10
REQUIREMENTS
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
CHANGE (ΔR/R)
PERMISSIBLE
10 Ω to 1 MΩ
± 100 ppm/K,
± 1 %; ± 5 %
± 200 ppm/K
SIZE 0201