V5.5MLA0603NH Littelfuse Inc, V5.5MLA0603NH Datasheet - Page 6

• Manufacturer Part Number: V5.5MLA0603NH
• Description: VARISTOR TVS MULTI 5.5V 30A 0603
• Manufacturer: Littelfuse Inc
• Series: MLr

Specifications of V5.5MLA0603NH

• Package / Case: 0603 (1608 Metric)
• Varistor Voltage: 9.3V
• Current-surge: 30A
• Number Of Circuits: 1
• Maximum Ac Volts: 4VAC
• Maximum Dc Volts: 5.5VDC
• Energy: 0.10J
• Voltage Rating Dc: 5.5 V
• Voltage Rating Ac: 4 V
• Clamping Voltage: 17.5 V
• Surge Energy Rating: 0.1 J
• Capacitance: 760 pF
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 1.6 mm L x 0.4 mm H
• Mounting: SMD/SMT
• Product: MLV
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free by exemption / RoHS Compliant
• Other names: F3363TR; V5.5MLA0603NH

MLA Varistor Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLA suppressor is
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLA chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
still necessary to ensure that any further thermal shocks
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination option (see
optimum Lead–free solder performance, consisting of a
Matte Tin outer surface plated on Nickel underlayer, plated
on Silver base metal.
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Revision: November 10, 2010
Varistor Products
Figure 14
Figure 15
Figure 16
Reflow Solder Profile
Wave Solder Profile
Lead–free Re-flow Solder Profile
300
250
200
100
250
200
150
100
150
300
250
200
150
100
50
50
50
Please refer to www.littelfuse.com/series/ML.html or MLA.html for current information.
0
0
0
0.0
0
0
0.5
0.5
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
1.0
PREHEAT ZONE
PREHEAT ZONE
1.0
1.0
PREHEAT DWELL
FIRST PREHEAT
2.0
MAXIMUM TEMPERATURE
1.5
1.5
TIME (MINUTES)
TIME (MINUTES)
MAXIMUM WAVE 260°C
TIME (MINUTES)
RAMP RATE
<3˚C/s
3.0
2.0
Specifications are subject to change without notice.
230°C
2.0
SECOND PREHEAT
RAMP RATE
<2°C/s
2.5
4.0
2.5
ABOVE 183°C
SECONDS
3.0
40-80
5.0
60 - 150 SEC
3.0
> 217˚C
3.5
6.0
3.5
©2010 Littelfuse, Inc.
4.0
4.0
4.5
7.0