V47CH8T Littelfuse Inc, V47CH8T Datasheet - Page 4

• Manufacturer Part Number: V47CH8T
• Description: VARISTR 47V 100A 1.2J SMD CH T/R
• Manufacturer: Littelfuse Inc
• Series: CHr

Specifications of V47CH8T

• Varistor Voltage: 47V
• Current-surge: 100A
• Number Of Circuits: 1
• Maximum Ac Volts: 30VAC
• Maximum Dc Volts: 38VDC
• Energy: 1.2J
• Package / Case: Non-Standard SMD
• Suppressor Type: Transient Current
• Peak Surge Current @ 8/20µs: 100A
• Clamping Voltage Vc Max: 92V
• Peak Energy (10/1000us): 1.2J
• Voltage Rating Vdc: 38V
• Voltage Rating Vac: 30V
• Voltage Rating Dc: 38 V
• Voltage Rating Ac: 30 V
• Clamping Voltage: 92 V
• Peak Surge Current: 250 A
• Capacitance: 800 pF
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 5 mm W x 8 mm L x 2.03 mm H
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free by exemption / RoHS Compliant
• Other names: F3455TR; V47CH8T

CH Varistor Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
CH series devices have silver-platinum terminals (Ag/Pt),
and the recommended solder is 62/36/2 (Sn/Pb/Ag), 60/40
(Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an
RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the CH chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Lead–free (Pb-free) Soldering Recommendations
CH series devices have silver-platinum terminals (Ag/Pt),
and the recommended Lead-free solder is 96.5/3.0/0.5
(SnAgCu) with an RMA flux, though there is a wide
selection of pastes and fluxes available that should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free Wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Surface Mount Varistors > CH Series
Varistor Products
Revision: August 30, 2010
Figure 7
Figure 8
Figure 9
Reflow Solder Profile
Wave Solder Profile
Lead–free Re-flow Solder Profile
300
250
200
150
100
250
200
150
100
300
250
200
150
100
50
50
50
0
0
0
0.0
0
0
0.5
0.5
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
1.0
Please refer to www.littelfuse.com/series/CH.html for current information.
PREHEAT ZONE
PREHEAT ZONE
1.0
1.0
PREHEAT DWELL
FIRST PREHEAT
2.0
MAXIMUM TEMPERATURE
1.5
1.5
TIME (MINUTES)
TIME (MINUTES)
MAXIMUM WAVE 260°C
TIME (MINUTES)
RAMP RATE
<3˚C/s
3.0
2.0
Specifications are subject to change without notice.
230°C
2.0
SECOND PREHEAT
RAMP RATE
<2°C/s
2.5
4.0
2.5
ABOVE 183°C
SECONDS
3.0
40-80
5.0
60 - 150 SEC
3.0
> 217˚C
3.5
6.0
3.5
©2010 Littelfuse, Inc.
4.0
4.0
4.5
7.0