CRCW12101K18FKEA Vishay, CRCW12101K18FKEA Datasheet - Page 6

• Manufacturer Part Number: CRCW12101K18FKEA
• Description: RES 1.18K OHM 1/2W 1% 1210 SMD
• Manufacturer: Vishay
• Series: CRCWr

Specifications of CRCW12101K18FKEA

• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 1.18K
• Power (watts): 0.5W, 1/2W
• Composition: Thick Film
• Tolerance: ±1%
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height: 0.022" (0.55mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 1210 (3225 Metric)
• Resistance In Ohms: 1.18K
• Case: 1210 (3225 metric)
• Peak Reflow Compatible (260 C): Yes
• Termination Type: SMD
• Leaded Process Compatible: Yes
• Limiting Element Voltage Max: 200V
• Mounting Type: Surface Mount
• Resistance: 1.18 KOhms
• Power Rating: 0.33 Watt (1/3 Watt)
• Termination Style: SMD/SMT
• Voltage Rating: 200 Volts
• Operating Temperature Range: - 55 C to + 155 C
• Dimensions: 2.5 mm W x 3.2 mm L x 0.55 mm H
• Product: Thick Film Resistors SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Details
• Other names: CRCW1210 100 1K18 1% ET1 E3

D/CRCW e3
Vishay
www.vishay.com
130
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Rapid change of
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Standard Thick Film Chip Resistors
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
This datasheet is subject to change without notice.
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C;  90 % RH;
55 °C;  90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) C
1000 cycles
 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
 U
; 60 s
;
x R
max.
;
[e-mail]
±0.25 % R + 0.05)
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
No visible damage, no open circuit in bent position
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
PERMISSIBLE CHANGE (R)
Good tinning ( 95 % covered)
Good tinning ( 95 % covered)
No flashover or breakdown
± (0.25 % R + 0.05 )
SIZE 0402 to 2512
No visible damage
REQUIREMENTS
no visible damage
no visible damage
1  to 10 M
± (0.5 % R + 0.05 )
±0.5 % R + 0.05)
Document Number: 20035
www.vishay.com/doc?91000
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
Revision: 08-Mar-11
± 5 %