SFR2500001500FR500 Vishay, SFR2500001500FR500 Datasheet - Page 8

• Manufacturer Part Number: SFR2500001500FR500
• Description: RES 150 OHM METAL FILM .40W 1%
• Manufacturer: Vishay
• Series: SFR25r

Specifications of SFR2500001500FR500

• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 150
• Power (watts): 0.4W
• Composition: Metal Film
• Tolerance: ±1%
• Size / Dimension: 0.098" Dia x 0.295" L (2.50mm x 7.50mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 150
• Case: Axial
• Resistance: 150ohm
• Resistance Tolerance: ± 1%
• Power Rating: 400mW
• Voltage Rating: 250V
• Resistor Element Material: Metal Film
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Height: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 5043ED150R0F12AF5; PPC150YTR

TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category temperature; damp heat, steady state, test
duration: 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
test method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
Document Number: 28722
Revision: 06-Aug-10
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
4.16
4.16.2
4.16.3
4.16.4
4.17
4.18
4.19
4.20
4.22
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.24
METHOD
60068-2-
21 (Ua1)
78 (Cab)
21 (Ub)
21 (Uc)
14 (Na)
30 (Db)
30 (Db)
20 (Tb)
29 (Eb)
20 (Ta)
13 (M)
2 (Ba)
1 (Aa)
TEST
6 (Fc)
IEC
Torsion other half
Climatic sequence:
remaining cycles
Rapid change of
Low air pressure
Robustness of
soldering heat
Resistance to
(steady state)
(accelerated)
(accelerated)
terminations:
Bending half
Solderability
Solderability
(after aging)
temperature
Damp heat
Damp heat
Damp heat
of samples
number of
Tensile all
Vibration
1st cycle
samples
samples
Dry heat
TEST
Bump
Cold
For technical questions, contact:
Standard Metal Film Leaded Resistors
Ø 0.45 mm, load 2.5 N; 4 x 90°
3 x 1500 bumps in 3 directions;
acceleration 10 g; 3 directions;
10 s; 260 °C; 3 mm from body
Ø 0.58 mm, load 5 N; 4 x 90°
for 2 s at 235 °C: Solder bath
for 3 s at 245 °C: Solder bath
Solder bath method; SnPb40
30 min at + 155 °C; 5 cycles
Frequency 10 Hz to 500 Hz;
2 h; 8.5 kPa; 15 °C to 35 °C
Ø 0.58 mm, load 10 N; 10 s
Ø 0.45 mm, load 5 N; 10 s
8 h steam or 16 h 155 °C;
displacement 1.5 mm or
leads immersed 6 mm;
30 min at - 55 °C and
in opposite directions
(SnAgCu0.5) method
(Steps: 0 V to 100 V)
Solder bath method;
loaded with 0.01 P
90 % to 100 % RH
95 % to 100 % RH
90 % to 95 % RH;
total 6 h (3 x 2 h)
Thermal shock:
56 days; 40 °C;
PROCEDURE
5 days; 55 °C;
SnAg3Cu0.5
16 h; 155 °C
24 h; 55 °C;
2 s; 235 °C:
3 s; 245 °C:
2 h; - 55 °C
(SnPb40)
3 x 360°
40 g
70
[e-mail]
In the Test Procedures and Requirements table, tests and
requirements are listed with reference to the relevant clauses
of IEC 60115-1 and IEC 60068-2-xx test methods. A short
description of the test procedure is also given. In some in-
stances deviations from the IEC recommendations were
necessary for our method of specifying. All soldering tests
are performed with mildly activated flux.
RESISTANCE
R ≤ 1 MΩ
R > 1 MΩ
RANGE
ΔR max.: ± (1 % R + 0.05 Ω)
SFR16S
ΔR max.: ± (0.25 % R + 0.05 Ω)
ΔR max.: ± (0.25 % R + 0.05 Ω)
ΔR max.: ± (0.25 % R + 0.05 Ω)
ΔR max.: ± (0.25 % R + 0.05 Ω)
ΔR max.: ± (0.25 % R + 0.05 Ω)
Good tinning (≥ 95 % covered);
Good tinning (≥ 95 % covered);
Vishay BCcomponents
Number of failures < 10 x 10
Number of failures < 10 x 10
ΔR max.: ± (1 % R + 0.05 Ω)
ΔR max.: ± (2 % R + 0.05 Ω)
R
R
REQUIREMENTS
SFR16S/25/25H
ins
ins
No damage
No damage
No damage
no damage
no damage
min.: 1000 MΩ
min.: 1000 MΩ
SFR25
www.vishay.com
± (2 % R
SFR25H
ΔR max.
+ 0.1 Ω)
-6
-6
41