DF17A(4.0)-50DP-0.5V(57) Hirose Electric Co Ltd, DF17A(4.0)-50DP-0.5V(57) Datasheet - Page 9

• Manufacturer Part Number: DF17A(4.0)-50DP-0.5V(57)
• Description: CONN HEADER 50POS .5MM SMD GOLD
• Manufacturer: Hirose Electric Co Ltd
• Series: DF17r

Specifications of DF17A(4.0)-50DP-0.5V(57)

• Connector Type: Header, Outer Shroud Contacts
• Number Of Positions: 50
• Pitch: 0.020" (0.50mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Mated Stacking Heights: 7mm, 8mm
• Height Above Board: 0.248" (6.30mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: H11152TR

A192
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DF17 Series 0.5mm Pitch Board to Board Connector
1. Recommended
2. Recommended Manual
3. Recommended
4. Board Warp(SMT)
5. Cleaning Condition
6. Cautions
Precautions
Temperature Profile
(SMT)
Soldering Condition
(SMT)
Screen Thickness
(SMT)
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
Note2: The temperature profile indicates the board surface temperature at the point of contacts
Soldering iron temperature: 350 3 oldering time: Within 2 seconds
0.15mm
Max 0.02mm in the connector center area, based on the both connector edges
Refer to the "Nylon Connector Use Hand book".
The header is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
there is a return to normal temperature between the first and second cycle.
with the connector terminals.