FX6-100S-0.8SV2(71) Hirose Electric Co Ltd, FX6-100S-0.8SV2(71) Datasheet - Page 13

• Manufacturer Part Number: FX6-100S-0.8SV2(71)
• Description: CONN RECEPT 100POS .8MM W/BOSS
• Manufacturer: Hirose Electric Co Ltd
• Series: FX6r

Specifications of FX6-100S-0.8SV2(71)

• Pitch: 0.031" (0.80mm)
• Number Of Rows: 2
• Connector Type: Receptacle, Center Strip Contacts
• Number Of Positions: 100
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Mated Stacking Heights: 7mm, 8mm, 9mm
• Height Above Board: 0.236" (6.00mm)
• Product Type: Receptacles
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 100
• Housing Material: Polyphenylene Sulfide (PPS)
• Contact Material: Phosphor Bronze
• Contact Plating: Tin
• Voltage Rating: 100 V
• Current Rating: 0.5 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: *FX6-100S-0.8SV2(71); H10814

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BPrecautions
1. Tolerance Clearance on Mating Side
2. Mounting Temperature Profile (Reference)
3. Board to Board Size
The effective contact length of the product is set to 1.7mm. Please use the products as to set the clearance within 1.0mm
between the header and the receptacle in the mating process.
The board to board size of the male/female connector shown in the application pattern doesn't include the solder paste
thickness. Thus, after the connector is mounted on the board, consider that the board to board size will be widened in
proportion to the solder paste thickness.
(ç)
260
240
220
200
180
160
140
0
150ç
Pre-heating time
(150 to 200ç)
90 to 120s
Time (Second)
200ç
Soldering Time
(220ç min.)
(MAX250ç)
MAX 60s
220ç
HRS test conditions
Test boardGlass epoxy 110mm∞55mm∞1.6mm thick
Solder method
Solder composition
Metal mask
Reflow cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
FX6 Series●0.8mm Pitch Stacking Height 5 to 9mm Connector
:Reflow
:Paste,
: 0.15mm thick
: 2 cycles
96.5%Sn/3%Ag/0.5%Cu
A155