FX8-100S-SV Hirose Electric Co Ltd, FX8-100S-SV Datasheet - Page 6

• Manufacturer Part Number: FX8-100S-SV
• Description: CONN RECEPT 100POS .6MM GOLD SMD
• Manufacturer: Hirose Electric Co Ltd
• Series: FX8r

Specifications of FX8-100S-SV

• Pitch: 0.023" (0.60mm)
• Number Of Rows: 2
• Connector Type: Receptacle, Center Strip Contacts
• Number Of Positions: 100
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Mated Stacking Heights: 3mm, 4mm
• Height Above Board: 0.089" (2.26mm)
• Product Type: Receptacles
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: *FX8-100S-SV; H2335

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BConnector Precautions for use
1. Tolerance Clearance on Mating Side
2. Fixation between Mounting Boards
3. Stacking Height Tolerance for Mating
4. Mounting Temperature Profile (Reference)
The effective contact length of the product is set to 0.7mm. Please use the product so as to set the clearance to less than
0.2mm between the header and the receptacle in the mating process.
The very low profile and compact product, so never fix the connector between boards by mating force only
(ç)
260
240
220
200
180
160
140
0
Note: Please Note that the above stacking tolerance doesn't include the solder paste thickness.
Stack 3mm
Stack 4mm
150ç
Pre-heating time
(150 to 200ç)
90±120s
Time (Second)
3
4
200ç
+0.3
_0.2
+0.3
_0.2
Soldering Time
mm
mm
(220ç min.)
(MAX 250ç)
MAX 60s
220ç
FX8, FX8C Series●0.6mm Pitch Stacking Height 3mm to 16mm Connector
HRS test conditions
Test boardGlass epoxy 161mm∞100mm∞1.6mm thick
Solder method
Solder composition
Metal mask
Reflow cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
:Reflow
:Paste,
: 0.15mm thick
: 2 cycles
96.5%Sn/3%Ag/0.5%Cu
A171